Analysis and Calculation for Heating and Temperature Rise of Magnetic Levitation Device

An accurate thermal analysis is the premise of device optimization,overheating prevention.A calculation method of heating and temperature rise based on the equivalent thermal circuit model of the electromagnetic device is proposed,the result of thermal circuit is compared with that of field-based simulation analysis to verify its correctness.First,the transient thermal field model of electromagnetic device is established by ANSYS which contained air-friction loss generated by the move-core of device rotation with shaft in the model,from the result of model analysis,it can be seen that the temperature distribution of the electromagnetic device;then,with analysis of the thermal path,the equivalent thermal circuit model is established,the temperature rises of every part of the electromagnetic device could be figured out by the "circuit" method;Finally,the results of thermal circuit based on the "circuit" is compared with the results of the finite element simulation based on the "field",the accuracy and feasibility of this equivalent thermal circuit model are verified because the temperature errors are all in the allowable range.The resistivity which changes with temperature rise is considered in thermal analysis based on "field" and "circuit",the coefficients of heat conductivity and convention are also considered as variables of temperature in the thermal analysis.