Fundamentals of Semiconductor Processing Technology

1: Semiconductor Crystals. 1.1. Crystals and Crystallographic Orientations. 1.2. The Silicon Crystal. 1.3. Wafer Preparation. 1.4. Compound Semiconductors. 2: Thermal Oxidation and Nitridation. 2.1. SiO2 and SiO2-Si Interface. 2.2. Thermal Oxidation. 3: Thin Film Deposition. 3.1. Chemical Vapor Deposition. 3.2. Chemical-Physical Deposition Processes. 3.3. Physical-Vapor Deposition. 4: Lithography. 4.1. Optical Lithography. 4.2. Resolution Enhancement Techniques. 4.3. Electron-Beam Lithography. 4.4. X-Ray Lithography. 4.5. Ion-Beam Lithography. 5: Contamination Control and Etch. 5.1. Clean Processes. 5.2. Etching. 6: Ion Implantation. 6.1. Principle of Operation. 6.2. Energy Loss and Range Distribution. 6.3. Crystal Damage and Dopant Activity. 7: Diffusion. 7.1. Point Defects. 7.2. Fick's Laws. 7.3. Non-Constant Diffusivity. 7.4. Diffusion in Polysilicon. 7.5. Diffusion in Insulators. 7.6. Diffusion Sources. 7.7. Gettering in Silicon. 8: Contact and Interconnect Technology. 8.1. Contact Metallurgy. 8.2. Poly-Metal Dielectrics. 8.3. Metal Interconnects. 8.4. Inter-Level Dielectrics. 8.5. Multi-Level Metals. 8.6. Reliability Considerations. Subject Index.