Multilayer sputter deposition stress control

Abstract The dependence of the intrinsic stress of sputter deposited thin films on the power applied to the RF magnetron plasma was investigated. Molybdenun films show tensile stress while silicon films show compressive stress using RF power between 100- and 500-W. The multilayer stress depends strongly on the RF power applied. Low stress multilayer films were produced by varying the relative thickness of each layer and by varying the RF power applied during deposition. Using this approach 10-mm square free-standing semitransparent multilayer films with good flatness and small roughness were fabricated.