Studies of Inkjet Printing Technology with Focus on Electronic Materials
暂无分享,去创建一个
[1] G. G. Stokes. "J." , 1890, The New Yale Book of Quotations.
[2] David G. Bucknall,et al. Nanolithography and patterning techniques in microelectronics , 2005 .
[3] S. Canumalla,et al. Interconnect Reliability Considerations in Portable Consumer Electronic Products , 2007 .
[4] Kwang-Young Kim,et al. Drop-on-Demand Solder Droplet Jetting System for Fabricating Microstructure , 2008, IEEE Transactions on Electronics Packaging Manufacturing.
[5] H. Kipphan. Handbook of Print Media , 2004 .
[6] J. Han,et al. Development of Ultrafine Indium Tin Oxide (ITO) Nanoparticle for Ink-Jet Printing by Low-Temperature Synthetic Method , 2008, IEEE Transactions on Nanotechnology.
[7] Hitoshi Ujiie,et al. Digital printing of textiles , 2006 .
[8] D. Baldwin,et al. Interfacial adhesion of nano-particle silver interconnects for electronics packaging application , 2008, 2008 58th Electronic Components and Technology Conference.
[9] Vivek Subramanian,et al. Plastic-Compatible Low Resistance Printable Gold Nanoparticle Conductors for Flexible Electronics , 2003 .
[10] Nasser N Peyghambarian,et al. Screen printing for the fabrication of organic light-emitting devices , 2001, SPIE Optics + Photonics.
[11] Takao Someya,et al. Organic transistors manufactured using inkjet technology with subfemtoliter accuracy , 2008, Proceedings of the National Academy of Sciences.
[12] Sashiro Uemura,et al. Ink-jet printing of nanoparticle catalyst for site-selective carbon nanotube growth , 2003 .
[13] M. Mickle,et al. Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits , 2005, IEEE Transactions on Electronics Packaging Manufacturing.
[14] K. Nawa,et al. Reliability study for CTE mismatching in build-up structure , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[15] J. Reynolds,et al. Conjugated polymers : processing and applications , 2006 .
[16] Thomas Sutter. An overview of digital printing for advanced interconnect applications , 2005 .
[17] John D. Perkins,et al. Direct-write inkjet printing for fabrication of barium strontium titanate-based tunable circuits , 2007 .
[18] Yang Yang,et al. Ink-Jet Printing, Self-Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature , 2005 .
[19] A. Tay. Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach , 2007 .
[20] Paul A. Kohl,et al. Silver metallization for advanced interconnects , 1999 .
[21] Ville Pekkanen,et al. Controlling warpage of molded package for inkjet manufacturing , 2008 .
[22] Tomi Mattila,et al. Electrical sintering of nanoparticle structures , 2008, Nanotechnology.
[23] H. Saito,et al. Evaluation of Inkjet Technology for Electronic Packaging and System Integration , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[24] K. Oyama,et al. Super fine wiring by inkjet printing , 2004, Digest of Papers. 2004 International Microprocesses and Nanotechnology Conference, 2004..
[25] K. M. Gardiner,et al. SPC and setup analysis for screen printed thick films , 1990 .
[26] Henning Sirringhaus,et al. Self-aligned inkjet printing of highly conducting gold electrodes with submicron resolution , 2007 .
[27] Jayanti Venkataraman,et al. Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Silver Dispersions , 2005 .
[28] M. Mäntysalo. Inkjet-Deposited Interconnections for Electronic Packaging , 2007 .
[29] Kazuhiro Murata,et al. Super-fine ink-jet printing for nanotechnology , 2003, Proceedings International Conference on MEMS, NANO and Smart Systems.
[30] A. Smith. Schubert , 1927 .
[31] S. Bhattacharya,et al. Liquid Crystal Polymer (LCP): The ultimate solution for low-cost RF flexible electronics and antennas , 2007, 2007 IEEE Antennas and Propagation Society International Symposium.
[32] Karlheinz Bock,et al. Polymer Electronics Systems - Polytronics , 2005, Proceedings of the IEEE.
[33] J. Papapolymerou,et al. Liquid Crystal polymer (LCP): a new organic material for the development of multilayer dual-frequency/dual-polarization flexible antenna arrays , 2005, IEEE Antennas and Wireless Propagation Letters.
[34] Kimmo Kaija,et al. Capability of inkjet technology in electronics manufacturing , 2009, 2009 59th Electronic Components and Technology Conference.
[35] Y. Kashiwagi,et al. A Variety of Silver Nanoparticle Pastes for Fine Electronic Circuit Pattern Formation , 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
[36] R. Akkerman,et al. Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material , 2009 .
[37] W. Tseng,et al. Particulate dispersion and freeform fabrication of BaTiO3 thick films via direct inkjet printing , 2006 .
[38] Takao Someya,et al. Organic-transistor-based flexible pressure sensors using ink-jet-printed electrodes and gate dielectric layers , 2006 .
[39] Todd Andrew Cleland. Printed electronics : the next inkjet revolution , 2003 .
[40] F. Marletta,et al. List , 1891 .
[41] Sawyer B. Fuller,et al. Ink-jet printed nanoparticle microelectromechanical systems , 2002 .
[42] Fine-line passive components for hybrid microelectronics , 1996 .
[43] Matti Mäntysalo,et al. Inkjet printed System-in-Package design and manufacturing , 2008, Microelectron. J..
[44] D. R. Gray,et al. Miniature sensors using high density screen printing , 1999 .
[45] Helmut Schaefer,et al. Inkjettable conductive adhesive for use in microelectronics and microsystems technology , 2005, Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
[46] H. Thomas Hahn,et al. Inkjet printed electronics for multifunctional composite structure , 2009 .
[47] Costas P. Grigoropoulos,et al. Conductor microstructures by laser curing of printed gold nanoparticle ink , 2004 .
[48] M. Weaver,et al. Thin-film permeation-barrier technology for flexible organic light-emitting devices , 2004, IEEE Journal of Selected Topics in Quantum Electronics.
[49] Antti Peräkamppi. Printed electronics - implementation, integration and applicability to products , 2007 .
[50] Li Yang,et al. Design of a novel high-efficiency UHF RFID antenna on flexible LCP substrate with high read-range capability , 2006, 2006 IEEE Antennas and Propagation Society International Symposium.
[51] Laurence W. McKeen,et al. Permeability Properties of Plastics and Elastomers , 2011 .
[52] Brian Derby,et al. Ink-jet delivery of particle suspensions by piezoelectric droplet ejectors , 2005 .
[53] Mikko A. Uusitalo,et al. Significance of Nanotechnology for Future Wireless Devices and Communications , 2007, 2007 IEEE 18th International Symposium on Personal, Indoor and Mobile Radio Communications.
[54] Ting Chen,et al. Ink-Jet as a MEMS Manufacturing Tool , 2007 .
[55] A. Zehe,et al. Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms , 2002, Microelectron. Reliab..
[56] Alexandra Pekarovicova,et al. Suitability of gravure printing for high volume fabrication of electronics , 2008 .
[57] H. Le,et al. Progress and Trends in Ink-jet Printing Technology , 1998, Journal of Imaging Science and Technology.
[58] Anupama Karwa,et al. Printing studies with conductive inks and exploration of new conducting polymer compositions , 2006 .
[59] David Harrison,et al. Lithographic film circuits – a review , 2001 .
[60] Gregory P. Crawford,et al. Flexible flat panel displays , 2005 .
[61] Wolfgang Kowalsky,et al. Large Area Electronics Using Printing Methods , 2005, Proceedings of the IEEE.
[62] Leonard C. Feldman,et al. Electronic thin film science : for electrical engineers and materials scientists , 1996 .
[63] J. Jang,et al. Fabrication of Water‐Dispersible Polyaniline‐Poly(4‐styrenesulfonate) Nanoparticles For Inkjet‐Printed Chemical‐Sensor Applications , 2007 .
[64] Inkjet-Printed Silver Gate Electrode and Organic Dielectric Materials for Bottom-Gate Pentacene Thin-Film Transistors , 2009 .
[65] Yongxiang Li,et al. Fabrication of BaTiO3 dielectric films by direct ink-jet printing , 2004 .
[66] Joel Kubby,et al. Inkjet printing of passive microwave circuitry , 2008, 2008 IEEE MTT-S International Microwave Symposium Digest.
[67] Y. Wu,et al. Enabling Materials for Printed Electronics , 2006, LEOS 2006 - 19th Annual Meeting of the IEEE Lasers and Electro-Optics Society.
[68] John Lewis. Material challenge for flexible organic devices , 2006 .
[69] Matti Mäntysalo,et al. An inkjet-deposited antenna for 2.4 GHz applications , 2009 .
[70] Michael J Cima,et al. Spreading and infiltration of inkjet-printed polymer solution droplets on a porous substrate. , 2002, Journal of colloid and interface science.
[71] J. Whitmarsh,et al. Flexible electronics: silicon meets paper and beyond , 2005 .
[72] Shlomo Magdassi and,et al. Patterning of Organic Nanoparticles by Ink-jet Printing of Microemulsions , 2003 .
[73] U. Caglar,et al. Usability of Ink‐Jet Printing Technology and Nanomaterials in Electrical Interconnections, Electronic Packaging, and System Integration for Microelectronics Applications , 2011 .
[74] W. Wang,et al. Patterned diamond particle films , 2000 .
[75] John Evans,et al. The computer aided manufacture of ceramics using multilayer jet printing , 1995 .
[76] S. Smith,et al. Design rules to minimize the effect of joule heating in Greek cross test structures , 2004, IEEE Transactions on Semiconductor Manufacturing.
[77] Artur Goldschmidt,et al. BASF Handbook Basics of Coating Technology , 2003 .
[78] Eerik Halonen. Printed electronics integration in a sensor platform application , 2009 .
[79] K. Maekawa,et al. Laser sintering of Ag nanopaste film and its application to bond-pad formation , 2008, 2008 58th Electronic Components and Technology Conference.
[80] U. Schubert,et al. Ink‐jet Printing and Microwave Sintering of Conductive Silver Tracks , 2006 .
[81] Donald J. Hayes,et al. MicroJet printing of solder and polymers for multi-chip modules and chip-scale packages , 1999 .
[82] C. Grigoropoulos,et al. Microstructuring by printing and laser curing of nanoparticle solutions , 2003 .
[83] D. Schulz,et al. Spray and Inkjet Printing of Hybrid Nanoparticle-Metal-Organic Inks for Ag and Cu Metallizations , 2001 .
[84] Jang Sub Kim,et al. Direct writing of copper conductive patterns by ink-jet printing , 2007 .
[85] Alberto Piqué,et al. Direct-write technologies for rapid prototyping applications : sensors, electronics and integrated power sources , 2002 .
[86] Leon L. Shaw,et al. Fabrication of Functionally Graded Materials Via Inkjet Color Printing , 2006 .
[87] S. Molesa,et al. Ultra-Low-Cost Printed Electronics , 2006 .
[88] J. W. Haslett,et al. Simulation of Temperature Cycling Effects on Electromigration Behavior Under Pulsed Current Stress , 1998 .
[89] D.F. Baldwin,et al. Performance of Silver Nano Particles as an Electronics Packaging Interconnects Material , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[90] F. Cardarelli. Materials Handbook — a concise desktop reference: Pub 2000, ISBN 1-85233-168-2. 595 pages, £80 , 2001 .
[91] P. Calvert. Inkjet Printing for Materials and Devices , 2001 .
[92] Shlomo Magdassi,et al. Silver Nanoparticles as Pigments for Water-Based Ink-Jet Inks , 2003 .
[93] Brian Derby,et al. A Low Curing Temperature Silver Ink for Use in Ink‐Jet Printing and Subsequent Production of Conductive Tracks , 2005 .
[94] Jie Zhang,et al. Investigation of Using Contact and Non-contact Printing Technologies For Organic Transistor Fabrication , 2002 .
[95] G. Irvin,et al. Organic Nanoparticles: Preparation, Self‐Assembly, and Properties , 2006 .
[96] F. P. Wieringa,et al. Systems in Foil — Opening new Perspectives in Medical Technology , 2009 .
[97] S. Almutawa,et al. The development of a connectionist expert system for compensation of color deviation in offset lithographic printing , 1999, Artif. Intell. Eng..
[98] A. D. Bermel,et al. Particle Generation and Ink Particle Size Effects in Pigmented Inkjet Inks – Part II , 1999 .
[99] Pekka Ruuskanen,et al. The characterization of electrically conductive silver ink patterns on flexible substrates , 2009, Microelectron. Reliab..
[100] A. Atkinson,et al. Continuous ink-jet printing using sol-gel “Ceramic” inks , 1997 .
[101] Nurdan Demirci Sankir,et al. FLEXIBLE ELECTRONICS: MATERIALS and DEVICE FABRICATION , 2005 .
[102] Anne Blayo,et al. Printing processes and their potential for RFID printing , 2005, sOc-EUSAI '05.
[103] Wijshoff H.M.A.,et al. Drop formation mechanisms in piezo-acoustic inkjet , 2007 .
[104] Marc D. Porter,et al. Alkanethiolate Gold Cluster Molecules with Core Diameters from 1.5 to 5.2 nm: Core and Monolayer Properties as a Function of Core Size , 1998 .
[105] W. Tseng,et al. Dispersion and rheology of nickel nanoparticle inks , 2006 .
[106] John Evans,et al. Solid freeforming of ceramics using a drop-on-demand jet printer , 1997 .
[107] Krzysztof Iniewski,et al. Low power 2.5 Gb/s serializer for SOC applications , 2004, IEEE Computer Society Annual Symposium on VLSI.
[108] Mohan Edirisinghe,et al. Formulation of a ceramic ink for a wide-array drop-on-demand ink-jet printer , 2003 .
[109] C. Grigoropoulos,et al. Air stable high resolution organic transistors by selective laser sintering of ink-jet printed metal nanoparticles , 2007 .
[110] U. Schubert,et al. Inkjet Printing of Polymers: State of the Art and Future Developments , 2004 .
[111] Ullrich Scherf,et al. Direct Ink‐Jet Printing of Ag–Cu Nanoparticle and Ag‐Precursor Based Electrodes for OFET Applications , 2007 .
[112] M. Ger,et al. A Novel Method Produces Pd nanoparticles for Ink-Jet Printing Technology , 2007, 2007 Digest of papers Microprocesses and Nanotechnology.
[113] V. Bulović,et al. Inkjet‐Printed Quantum Dot–Polymer Composites for Full‐Color AC‐Driven Displays , 2009 .
[114] Christine Gilbert,et al. Moon , 1997, The Lancet.
[115] J. Lewis,et al. Direct-write assembly of ceramics from colloidal inks , 2002 .
[116] Jooho Moon,et al. Highly Conductive Ink Jet Printed Films of Nanosilver Particles for Printable Electronics , 2005 .
[117] A. Salleo,et al. Flexible Electronics: Materials and Applications , 2009 .
[118] M. Mantysalo,et al. Molded Substrates for Inkjet Printed Modules , 2009, IEEE Transactions on Components and Packaging Technologies.
[119] J. Puetz,et al. Manufacturing of polymer light-emitting device structures , 2006, SPIE Photonics Europe.
[120] C. K. Ong,et al. Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[121] Esa Kunnari,et al. Environmental evaluation of new technology: printed electronics case study , 2009 .
[122] M. Aegerter,et al. Direct gravure printing of indium tin oxide nanoparticle patterns on polymer foils , 2008 .
[123] JiHyun Bae. Behavior of Prepared-For-Print Fabrics in Digital Printing Traci May-Plumlee, Assistant Professor Textile and Apparel, Technology and Management 2401 Research Drive, Box 8301, NCSU Raleigh, NC 27695-8301 919-513-4196 , 2005 .
[124] M. Fuhrer,et al. Extraordinary Mobility in Semiconducting Carbon Nanotubes , 2004 .
[125] Hiroshi Yokoyama,et al. Super-fine ink-jet printing: toward the minimal manufacturing system , 2005 .
[126] K. Murata. Direct Fabrication of Super -Fine Wiring and Bumping by Using Inkjet process , 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
[127] John D. Perkins,et al. Direct inkjet printing of composite thin barium strontium titanate films , 2003 .
[128] Daniel Gamota,et al. Printed Organic and Molecular Electronics , 2004 .
[129] Heli Jantunen,et al. Inkjet printing of electrically conductive patterns of carbon nanotubes. , 2006, Small.
[130] Hood Chatham,et al. Oxygen diffusion barrier properties of transparent oxide coatings on polymeric substrates , 1996 .
[131] G. Graff,et al. Barrier layer technology for flexible displays , 2005 .
[132] C. Grigoropoulos,et al. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles , 2007 .
[133] Costas P. Grigoropoulos,et al. Lithography-free high-resolution organic transistor arrays on polymer substrate by low energy selective laser ablation of inkjet-printed nanoparticle film , 2008 .
[134] Werner Zapka,et al. Application of inkjet technology for the deposition of magnetic nanoparticles to form micron-scale structures , 2003 .
[135] S. Yeates,et al. Inkjet printing of 3D metal-insulator-metal crossovers , 2008 .
[136] J. E. Fromm,et al. Numerical calculation of the fluid dynamics of drop-on-demand jets , 1984 .
[137] Kimmo Kaija,et al. Analysis of mechanical performance of silver inkjet-printed structures , 2008, 2008 2nd IEEE International Nanoelectronics Conference.
[138] Chris Jeynes,et al. Patterned low temperature copper-rich deposits using inkjet printing , 2002 .
[139] E. Suhir. Accelerated life testing in microelectronics and photonics, its role, attributes, challenges, pitfalls, and its interaction with qualification tests , 2002, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).
[140] U. Caglar,et al. Evaluation of adhesion pull-off performance of nanoparticle-based inkjet-printed silver structure on various substrates , 2009 .