A general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology

In this paper a generic four- parameter model has been developed and applied to the ACA flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on Flip-Chip anisotropically conductive adhesive joints on an FR-4 substrate, In the study, nine types of anisotropic conductive adhesive (ACA) and one non-conductive film (NCF) were used, In total, nearly one thousand single joints were subjected to reliability tests in terms of temperature cycling between -40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110 °C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles, A single Weibull model is used for two failure definitions defined as larger than 50mΩ and larger than 100 mΩ respectively using the in-situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This study shows the flexibility and usefulness of Weibull distribution in this type of applications.

[1]  R. D. Gerke,et al.  Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors , 1999 .

[2]  Y. M. Tan,et al.  Board level reliability assessment of chip scale packages , 1999 .

[3]  J. Malmodin,et al.  A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive , 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).

[4]  Takashi Nukii,et al.  Reliability of soldered joints in CSPs of various designs and mounting conditions , 1998, 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).

[5]  M. Amagai,et al.  Chip scale package (CSP) solder joint reliability and modeling , 1998, 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).

[6]  Y. Wang,et al.  Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter , 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

[7]  Michael Pecht,et al.  Criteria for the assessment of reliability models , 1997 .

[8]  J. Kimura,et al.  A new anisotropic conductive film with arrayed conductive particles , 1996 .

[9]  Johan Liu,et al.  Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates , 1996 .

[10]  Johan Liu.  On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation , 1996 .

[11]  T. Tamai.  Effect of silicone vapour and humidity on contact reliability of micro relay contacts , 1995, Electrical Contacts - 1995. Proceedings of the Forty-First IEEE Holm Conference on Electrical Contacts.

[12]  Johan Liu,et al.  An Overview of Advances in Conductive Adhesive Joining Technology for Electronics Applications , 1995 .

[13]  T. Tiefel,et al.  Anisotropically conductive polymer films with a uniform dispersion of particles , 1993 .

[14]  David J. Williams,et al.  The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections , 1993 .

[15]  C.F. Joyce,et al.  A Weibull model to characterize lifetimes of aluminium alloy electrical wire connections , 1990, Thirty-Sixth IEEE Conference on Electrical Contacts, and the Fifteenth International Conference on Electrical Contacts.

[16]  W. Weibull.  A Statistical Distribution Function of Wide Applicability , 1951 .