반도체 금형의 와이어방전가공을 위한 미세홀 방전가공

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the eJectrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1㎜ to 3.0㎜ with the error of from 0.02㎜ to 0.12㎜. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.