Four-degree-of-freedom combined sensor

The invention discloses a four-degree-of-freedom combined sensor. A PCB serves as a substrate, a chipset which is provided with a pressure sensor and a magnetic sensor and has the pressure sensor signal conditioning function and the magnetic sensor signal conditioning function is packaged in a stacking integration mode, when chip attachment is carried out, stacking is carried out according to the sizes of chips and the functions of the chips, then, electrical connection is completed through a lead bonding technology, and finally, the chips and leads are protected by carrying out adhesive dispensing or plastic packaging. The 4DOF combined sensor has the advantages of being small in size and wide in installation position selection range, a manufacturer of smart mobile phones or wearable devices only needs to make the 4DOF combined sensor and a GPS and 6DOF motion sensor be used in cooperation, and then accurate positioning and accurate navigation can be achieved.