Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens
暂无分享,去创建一个
S. Wiese | K.-J. Wolter | R. Metasch | M. Roellig | K. Wolter | M. Roellig | S. Wiese | R. Metasch | J.C. Boareto | J. C. Boareto
[1] A. A. El-Rehim. Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy , 2008 .
[2] William J. Plumbridge. The analysis of creep data for solder alloys , 2003 .
[3] J. Clech. An extension of the omega method to primary and tertiary creep of lead-free solders , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..
[4] Mike Roellig,et al. The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
[5] K. Wolter,et al. Analytical and Mechanical Methods for Material Property Investigations of SnAgCu-Solder , 2006, 2006 1st Electronic Systemintegration Technology Conference.
[6] R. Darveaux,et al. Mechanical Properties of Lead-Free Solders , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[8] S. Rzepka,et al. The Influence of Size and Composition on the Creep of SnAgCu Solder Joints , 2006, 2006 1st Electronic Systemintegration Technology Conference.
[9] R. S. Sidhu,et al. Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints , 2008 .
[10] D. Bhate,et al. Constitutive behavior of SN3.8AG0.7CU and SN1.0AG0.5CU alloys at creep and low strain rate regimes , 2007 .
[11] R. Labie,et al. Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblies in Shear Loading , 2007, 2007 9th Electronics Packaging Technology Conference.
[12] R. Harrington. Part II , 2004 .
[13] Steffen Wiese,et al. Creep of thermally aged SnAgCu-solder joints , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
[14] B. Michel,et al. Thermal fatigue modelling for SnAgCu and SnPb solder joints , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
[15] Martin Prager,et al. The Omega Method–An Engineering Approach to Life Assessment , 2000 .