Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens

The paper presents extended creep properties of eutectic SnAg3.8Cu0.7 solder using dog bone shaped tensile specimen to extend the data for the Alpha-Omega Model. The tensile test machine was carefully modified with respect of solder material requirements in terms of stress free specimen mounting and assurances of high stable stress conditions. Furthermore the tensile tester is able to measure the deformation of the specimen directly on the specimen, which allows more precise tests and more independence from temperature and stress dependent tester parts like the clamping and the rods. The tests were performed in three temperatures: 25 °C, 75 °C and 125 °C and three different stresses at each temperature.

[1]  A. A. El-Rehim Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy , 2008 .

[2]  William J. Plumbridge The analysis of creep data for solder alloys , 2003 .

[3]  J. Clech An extension of the omega method to primary and tertiary creep of lead-free solders , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[4]  Mike Roellig,et al.  The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[5]  K. Wolter,et al.  Analytical and Mechanical Methods for Material Property Investigations of SnAgCu-Solder , 2006, 2006 1st Electronic Systemintegration Technology Conference.

[6]  R. Darveaux,et al.  Mechanical Properties of Lead-Free Solders , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[8]  S. Rzepka,et al.  The Influence of Size and Composition on the Creep of SnAgCu Solder Joints , 2006, 2006 1st Electronic Systemintegration Technology Conference.

[9]  R. S. Sidhu,et al.  Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints , 2008 .

[10]  D. Bhate,et al.  Constitutive behavior of SN3.8AG0.7CU and SN1.0AG0.5CU alloys at creep and low strain rate regimes , 2007 .

[11]  R. Labie,et al.  Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblies in Shear Loading , 2007, 2007 9th Electronics Packaging Technology Conference.

[12]  R. Harrington Part II , 2004 .

[13]  Steffen Wiese,et al.  Creep of thermally aged SnAgCu-solder joints , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

[14]  B. Michel,et al.  Thermal fatigue modelling for SnAgCu and SnPb solder joints , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

[15]  Martin Prager,et al.  The Omega Method–An Engineering Approach to Life Assessment , 2000 .