论文信息 - The effect of silver and copper nanoparticles as resin fillers on less-studied properties of UF-based particleboards - 字舞流文

The effect of silver and copper nanoparticles as resin fillers on less-studied properties of UF-based particleboards

H. R. Taghiyari | A. Papadopoulos | R. Majidi | A. Esmailpour | Vahid Hassani | Rasol Abdolah Mirzaei | O. F. Bibalan