Trade-Offs Between RF Performance and Total-Dose Tolerance in 45-nm RF-CMOS
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En Xia Zhang | J. D. Cressler | R. D. Schrimpf | G. Freeman | R. Arora | A. K. Sutton | D. M. Fleetwood | H. Nayfeh | peixiong zhao | E. Zhang | J. Cressler | D. Fleetwood | G. Freeman | A. Sutton | R. Arora | S. Seth | G. L. Rosa | S. Seth | H. M. Nayfeh
[1] S. Cristoloveanu,et al. Silicon-on-nothing MOSFETs: performance, short-channel effects, and backgate coupling , 2004, IEEE Transactions on Electron Devices.
[2] E. R. Hsieh,et al. The understanding of strain-induced device degradation in advanced MOSFETs with process-induced strain technology of 65nm node and beyond , 2010, 2010 IEEE International Reliability Physics Symposium.
[3] A.A. Abidi,et al. RF CMOS comes of age , 2004, 2003 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.03CH37408).
[4] S. Narasimha,et al. Impact of Lateral Asymmetric Channel Doping on 45-nm-Technology N-Type SOI MOSFETs , 2009, IEEE Transactions on Electron Devices.
[5] K. Ishimaru,et al. Channel Width Dependence of Hot-Carrier Induced Degradation in Shallow Trench Isolated pMOSFETs , 1998, 28th European Solid-State Device Research Conference.
[6] Qingqing Liang,et al. The Enhanced Role of Shallow-Trench Isolation in Ionizing Radiation Damage of 65 nm RF-CMOS on SOI , 2009, IEEE Transactions on Nuclear Science.
[7] Karl Hess,et al. MOSFET degradation kinetics and its simulation , 2003 .
[8] M. Turowski,et al. Temperature-Dependence of Off-State Drain Leakage in X-Ray Irradiated 130 nm CMOS Devices , 2006, IEEE Transactions on Nuclear Science.
[9] J. C. Hsieh,et al. Impact of the strained SiGe source/drain on hot carrier reliability for 45 nm p-type metal-oxide-semiconductor field-effect transistors , 2008 .
[10] En Xia Zhang,et al. Layout-Related Stress Effects on Radiation-Induced Leakage Current , 2010, IEEE Transactions on Nuclear Science.
[11] D. Fullagar,et al. CMOS comes of age , 1980, IEEE Spectrum.
[12] Daniel M. Fleetwood,et al. Radiation‐induced charge neutralization and interface‐trap buildup in metal‐oxide‐semiconductor devices , 1990 .
[13] Chenming Hu,et al. Enhanced hot-carrier induced degradation in shallow trench isolated narrow channel PMOSFET's , 1998, IEEE Electron Device Letters.
[14] John D. Cressler,et al. Impact of Source/Drain contact and gate finger spacing on the RF reliability of 45-nm RF nMOSFETs , 2011, 2011 International Reliability Physics Symposium.
[15] T. Isaacs-Smith,et al. The Effects of Proton Irradiation on 90 nm Strained Si CMOS on SOI Devices , 2006, 2006 IEEE Radiation Effects Data Workshop.
[16] P. Dodd,et al. Radiation effects in SOI technologies , 2003 .
[17] S P Buchner,et al. Evaluating the Influence of Various Body-Contacting Schemes on Single Event Transients in 45-nm SOI CMOS , 2010, IEEE Transactions on Nuclear Science.
[18] Xin Wang,et al. Stress engineering for 32nm CMOS technology node , 2008, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology.
[19] John D. Cressler,et al. Impact of body tie and Source/Drain contact spacing on the hot carrier reliability of 45-nm RF-CMOS , 2010, 2010 IEEE International Integrated Reliability Workshop Final Report.
[20] C. Capasso,et al. Total dose radiation response of a 45nm SOI Technology , 2010, 2010 IEEE International SOI Conference (SOI).