On resonant effects in multilayer RF/microwave printed circuit board applications
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[1] R. Clark,et al. Simulation of multi-chip module package resonance using commercial finite element electromagnetic software , 1995, IMS 1995.
[2] V.K. Tripathi,et al. Modeling and simulation of switching noise including power/ground plane resonance for high speed GaAs FET logic (FL) circuits , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.
[3] I. J. Bahl,et al. Microstrip Antennas , 1980 .
[4] Linda P. B. Katehi,et al. Computation of switching noise in printed circuit boards , 1997 .
[5] N. Georgieva,et al. Time-domain vector-potential analysis of complex RF multilayer structures via segmentation technique , 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).
[6] E. Yamashita,et al. Time-domain vector-potential analysis of transmission-line problems , 1998 .
[7] A. Tessmann,et al. Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits , 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).
[8] Jiayuan Fang,et al. Shorting via arrays for the elimination of package resonance to reduce power supply noise in multi-layered area-array IC packages , 1998, Proceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211).