Ultra-High Density VLSI Modules

A novel packaging approach is described for low-power digital VLSI (very large-scale integration) technologies, which provides low-capacity interconnections throughout and eliminates higher packaging levels. The approach is based on the use of hybrid circuits utilizing high-density interconnections on sapphire substractes with a Fotoceram (trademark-Corning Glass Company) backing. These sapphire/Fotoceram wafers are assembled in a single stack, and wafer-to-wafer interconnections are provided by a ring of elastomeric contacts. This assembly is mounted in a sealed container utilizing ebullient cooling. This design provides very high packaging densities, minimizes circuit delays, and is easily maintainable.