Formation and growth of nanocavities and cavities induced by He+ implantation in silicon

Nanocavities and cavities are known to be efficient gettering sites for metallic impurities in silicon. Here, we report results from implanted 〈100〉 silicon at room temperature with 50 keV helium ions at a dose of 3×1016  cm −2. Due to its low solubility, He segregates in gas-vacancy complexes and forms nanobubbles. Then, during an N 2 ambient annealing at 800 °C using either rapid thermal annealing (RTA) or conventional furnace annealing, nanobubbles grow and He is released from the nanobubbles by gas exodiffusion, leading to (nano)cavities’ formation. (Nano)cavities and residual defects were observed by transmission electron microscopy (TEM). The fraction of retained helium was shown to decrease with annealing time according to the first-order gas release model. Two nucleation-growth mechanisms involved in the growth of these (nano)cavities have been studied. A remarkable result shows evidence about the balance-time dependence of the two mechanisms involved in the growth process of (nano)cavities. At the very beginning (30 s) of the annealing, the main mechanism is the migration-coalescence including nanobubbles and vacancy-helium complexes leading to the cavities’ formation. Then, the Ostwald ripening mechanism, related to the helium exodiffusion, between the nanocavities and cavities appeared.

[1]  N. Hanagata,et al.  Oxide-based inorganic/organic and nanoporous spherical particles: synthesis and functional properties , 2013, Science and technology of advanced materials.

[2]  U. Kortshagen Nonthermal plasma synthesis of semiconductor nanocrystals , 2009 .

[3]  Karen Willcox,et al.  Kinetics and kinematics for translational motions in microgravity during parabolic flight. , 2009, Aviation, space, and environmental medicine.

[4]  S. Godey,et al.  Defects in silicon induced by high energy helium implantation and their evolution during anneals , 2000 .

[5]  S. Libertino,et al.  Lifetime control in silicon devices by voids induced by He ion implantation , 1996 .

[6]  D. Follstaedt,et al.  INTERACTION OF COPPER WITH CAVITIES IN SILICON , 1996 .

[7]  W. Wampler,et al.  Chemical and electrical properties of cavities in silicon and germanium , 1995 .

[8]  W. Skorupa,et al.  Proximity gettering of transition metals in separation by implanted oxygen structures , 1995 .

[9]  S. U. Campisano,et al.  Gettering of metals by voids in silicon , 1995 .

[10]  S. U. Campisano,et al.  Silicon‐on‐insulator produced by helium implantation and thermal oxidation , 1995 .

[11]  E. Rimini,et al.  Gettering of metals by He induced voids in silicon , 1995 .

[12]  P. C. Jong,et al.  Helium desorption/permeation from bubbles in silicon: A novel method of void production , 1987 .

[13]  R. Yankov,et al.  Helium Induced Cavities in Silicon: Their Formation, Microstructure and Gettering Ability , 1997 .

[14]  D. Follstaedt,et al.  Deuterium interactions in oxygen‐implanted copper , 1989 .