Annealing-induced Ge/Si(100) island evolution

Ge/Si(100) islands were found to coarsen during in situ annealing at growth temperature. Islands were grown by molecular-beam epitaxy of pure Ge and annealed at substrate temperatures of T=450, 550, 600, and 650 °C, with Ge coverages of 6.5, 8.0, and 9.5 monolayers. Three coarsening mechanisms operate in this temperature range: wetting-layer consumption, conventional Ostwald ripening, and Si interdiffusion. For samples grown and annealed at T=450 °C, consumption of a metastably thick wetting layer causes rapid initial coarsening. Slower coarsening at longer annealing times occurs by conventional Ostwald ripening. Coarsening of samples grown and annealed at T=550 °C occurs via a combination of Si interdiffusion and conventional Ostwald ripening. For samples grown and annealed at T⩾600 °C, Ostwald ripening of SiGe alloy clusters appears to be the dominant coarsening mechanism.

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