Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

Laser Induced Forward Transfer (LIFT) is a single step, dry deposition process which shows great potential for interconnect fabrication. TNO, in cooperation with ALSI and University of Twente have studied the feature size and resistivity of copper structures deposited using picosecond (ps) LIFT. Small droplets are generated in response to single pulses at high repetition rate (400kHz). It has been shown that with a relatively simple setup, very promising features could be realized. These first results justify further development of the process towards industrial application.