论文信息 - Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low k technologies - 字舞流文

Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low k technologies

Huixian Wu | S. Horvat | S. Merchant | V. Archer | J. Cargo | D. Chesire | J. Antol | R. Mengel | J. Osenbach | C. Peridier | M. White