Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method

The junction temperature <inline-formula> <tex-math notation="LaTeX">$(T_{j})$ </tex-math></inline-formula> of LEDs in an LED luminaire is useful for projecting the luminous flux maintenance or lifetime of luminaires. Normally, a LED luminaire has a unique and complex geometric outline, and its LED package size is only a few millimeters. The thermal modeling procedure with one luminaire model is complex. Achieving a precise <inline-formula> <tex-math notation="LaTeX">$T_{j}$ </tex-math></inline-formula> of luminaires quickly in modeling is still a great challenge. In this work, aiming at providing a simple modeling method to predict a precise luminaire <inline-formula> <tex-math notation="LaTeX">$T_{j}$ </tex-math></inline-formula>, a subsystem-separated thermal modeling method for luminaires is proposed by following the existing form of multi-domain modeling. The detailed package model is linked with the luminaire model, while the average temperature at the bottom surface of the LED package is associated with an assumed equivalent convective heat transfer coefficient (ECHTC) at the package model. An adequately assumed ECHTC is obtained, while a unique average temperature is achieved from the luminaire model. Results show that a precise luminaire <inline-formula> <tex-math notation="LaTeX">$T_{j}$ </tex-math></inline-formula> is projected rapidly by modeling the package model with the adequate ECHTC and a proposed power law equation. The proposed modeling method not only provides a precise <inline-formula> <tex-math notation="LaTeX">$T_{j}$ </tex-math></inline-formula> prediction with a small error but also effectively simplifies the modeling of LED luminaires.

[1]  Dirk Schweitzer Thermal transient characterization of semiconductor devices with multiple heat sources - Fundamentals for a new thermal standard , 2013 .

[2]  George N. Barakos,et al.  Natural convection flow in a square cavity revisited: Laminar and turbulent models with wall functions , 1994 .

[3]  Cadmus Yuan,et al.  Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes , 2014 .

[4]  Ping Zhang,et al.  Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method , 2015, Microelectron. Reliab..

[5]  R. Tsai,et al.  散熱鰭片幾何尺寸對高功率LED模組熱傳性能之研究 A Study of Heat-Sink Geometry on the Heat Transfer Performance of High-Power LED Modules , 2007 .

[6]  Wang Xian Thermal analysis and test for convection-cooled LED lamp , 2014 .

[7]  Seung-Jae Park,et al.  The orientation effect for cylindrical heat sinks with application to LED light bulbs , 2014 .

[8]  Ping Yang,et al.  Experimental and numerical approach on junction temperature of high-power LED , 2014, Microelectron. Reliab..

[9]  B. Siegal Practical Considerations in High Power LED Junction Temperature Measurements , 2006, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

[10]  Geert Deconinck,et al.  High power light-emitting diode junction temperature determination from current-voltage characteristics , 2008 .

[11]  Kai-Shing Yang,et al.  Thermal spreading resistance characteristics of a high power light emitting diode module , 2014 .

[12]  L. G. Valladares-Rendón,et al.  Numerical analysis of the effect of a central cylindrical opening on the heat transfer of radial heat sinks for different orientations , 2017 .

[13]  A.J. Perin,et al.  Junction Temperature Estimation for High Power Light-Emitting Diodes , 2007, 2007 IEEE International Symposium on Industrial Electronics.

[14]  Andras Poppe,et al.  Thermal Management for LED Applications , 2013 .

[16]  Chi-Yuan Lee,et al.  In Situ Measurement of the Junction Temperature of Light Emitting Diodes Using a Flexible Micro Temperature Sensor , 2009, Sensors.

[17]  Guoqi Zhang,et al.  Thermal Transient Effect and Improved Junction Temperature Measurement Method in High-Voltage Light-Emitting Diodes , 2013, IEEE Electron Device Letters.

[18]  W. B. Chen,et al.  Accelerated testing method of LED luminaries , 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[19]  Vitor A. F. Costa,et al.  Improved radial heat sink for led lamp cooling , 2014 .

[20]  Tien-Mo Shih,et al.  Junction-Temperature Determination in InGaN Light-Emitting Diodes Using Reverse Current Method , 2013, IEEE Transactions on Electron Devices.

[21]  Nadarajah Narendran,et al.  Analysis of three different junction temperature estimation methods for AC LEDs , 2013 .

[22]  András Poppe,et al.  Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment , 2017, Microelectron. Reliab..

[23]  Analysis and Modeling of Thermal Effect and Optical Characteristic of LED Systems With Parallel Plate-Fin Heatsink , 2017, IEEE Photonics Journal.

[24]  G. P. Peterson,et al.  Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays , 2013 .

[25]  Andras Poppe,et al.  Electro-thermal simulation for the prediction of chip operation within the package , 2003, Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..

[26]  Mb Yurtseven,et al.  Thermal simulation and validation of LED-based luminaires using two-resistor compact thermal model , 2014 .

[27]  Y. Hsu,et al.  Lifetime Distribution and Reliability Analysis of High-Power LED Assembly of Street Light Under Thermal Environments , 2018, International Journal of Reliability, Quality and Safety Engineering.

[28]  Wenbin Chen,et al.  A hybrid prediction method on luminous flux maintenance of high-power LED lamps , 2016 .

[29]  Hsien-Chie Cheng,et al.  On the thermal characterization of an RGB LED-based white light module , 2012 .

[30]  Jung-Chang Wang Thermal module design and analysis of a 230 W LED illumination lamp under three incline angles , 2014, Microelectron. J..

[31]  Andras Poppe,et al.  Creating multi-port thermal network models of LED luminaires for application in system level multi-domain simulation using spice-like solvers , 2016, 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

[32]  Liang Jin,et al.  Analysis of Thermal Field on Integrated LED Light Source Based on COMSOL Multi-physics Finite Element Simulation , 2011 .

[33]  Ming-Tzer Lin,et al.  Heat dissipation design and analysis of high power LED array using the finite element method , 2012, Microelectron. Reliab..

[34]  N. C. Chen,et al.  Determination of junction temperature in AlGaInP∕GaAs light emitting diodes by self-excited photoluminescence signal , 2006 .

[35]  Chun Zhang,et al.  Thermal design and simulation of automotive headlamps using white LEDs , 2014, Microelectron. J..

[36]  J. Liu,et al.  Flow and heat transfer in porous micro heat sink for thermal management of high power LEDs , 2011, Microelectron. J..

[37]  Jiri Jakovenko,et al.  Thermal simulation and validation of 8W LED Lamp , 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[38]  Márta Rencz,et al.  Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires , 2019, Energies.

[39]  Daming Sun,et al.  Orientation effects on natural convection heat dissipation of rectangular fin heat sinks mounted on LEDs , 2014 .

[40]  Stefan Müller,et al.  Evaluation of thermal transient characterization methodologies for high-power LED applications , 2011, 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[41]  Xiaobing Luo,et al.  Can thermocouple measure surface temperature of light emitting diode module accurately , 2013 .