Compact Models for Novel Interconnects Using Unified Approach

In the last chapter we presented a qualitative summary of some of the commonly used modeling approaches. We concluded that the unified approach as presented by authors provides an efficient and accurate modeling technique. However, the previous publications by the same authors limit the use of this technique to MIC and MMIC applications only. Since chip–chip interconnects resemble planar transmission lines, the unified approach can be used to effectively model these high-speed interconnects as well. Having laid the foundation for the use of the unified approach in the previous chapter, we now present its applicability in analyzing high-speed interconnects. In particular, we present a composite parameter extraction algorithm followed by models for transient analysis of these interconnects. The application of unified approach for more standard structures such as the microstrip and stripline-like interconnects is already explained in the available literature and is therefore not covered in this chapter. Rather we present the analysis of complex yet practical interconnect geometries that are used in Printed Circuit Board (PCB) and Multichip module (MCM) applications nowadays.