The Effects of Sintering Temperature Variations on Microstructure Changes of LTCC Substrate
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[1] Suk‐Joong L. Kang,et al. Densification And Shrinkage During Liquid-Phase Sintering , 1991 .
[2] K. Yoon,et al. Abnormal Grain Growth at the Interface of Centrifugally Cast Alumina Bilayer during Sintering , 2004 .
[3] Sunit Rane,et al. Firing and processing effects on microstructure of fritted silver thick film electrode materials for solar cells , 2003 .
[4] Marion Matters-Kammerer,et al. Material properties and RF applications of high k and ferrite LTCC ceramics , 2006, Microelectron. Reliab..
[5] G. Fantozzi,et al. Influence of the amount of Na2O and SiO2 on the sintering behavior and on the microstructural evolution of a Bayer alumina powder , 2005 .
[6] Sea-Fue Wang,et al. Effects of additives on the densification and microstructural evolution of fine θ-Al2O3 powder , 2003 .
[7] A. Roosen,et al. Viscous Flow as the Driving Force for the Densification of Low-Temperature Co-Fired Ceramics , 2007 .
[8] G. Beall,et al. Microstructural Evolution in Some Silicate Glass–Ceramics: A Review , 2008 .
[9] W. Jo,et al. Effect of Interface Structure on the Microstructural Evolution of Ceramics , 2006 .
[10] S. Dillon,et al. Mechanism for the development of anisotropic grain boundary character distributions during normal grain growth , 2009 .
[11] D. Sinclair,et al. Microwave Dielectric Properties of Low Firing Temperature Bi2W2O9 Ceramics , 2008 .
[12] R. M. Cannon,et al. Abnormal Grain Growth in Alumina: Synergistic Effects of Yttria and Silica , 2003 .
[13] M. Rahaman. Ceramic Processing and Sintering , 1995 .
[14] G. Rohrer. Chapter 12 – The Anisotropy of Metal Oxide Surface Properties , 2001 .
[15] Hong Wang,et al. Dielectric Behavior and Cofiring with Silver of Monoclinic BiSbO4 Ceramic , 2008 .
[16] I. Lin,et al. Microwave dielectric properties of glass-MCT low temperature co-firable ceramics , 2004 .
[17] P. Raj,et al. Anisotropic shrinkage in tape-cast alumina : Role of processing parameters and particle shape , 2004 .
[18] W. D. Kingery,et al. Introduction to Ceramics , 1976 .
[19] Songping Wu,et al. Behaviors of ZnO-doped silver thick film and silver grain growth mechanism , 2011 .
[20] S. Küçükbayrak,et al. The influence of the binder on the properties of sintered glass-ceramics produced from industrial wastes , 2009 .
[21] Charles A. Harper,et al. Hybrid Microelectronics Handbook , 1995 .
[22] Aicha Elshabini,et al. Ceramic Interconnect Technology Handbook , 2007 .
[23] Heping Zhou,et al. Densification and dielectric properties of CaO–B2O3–SiO2 system glass ceramics , 2003 .
[24] R. Drew,et al. Wettability and spreading kinetics of molten aluminum on copper-coated ceramics , 2006 .
[25] J. Jean,et al. Devitrification Kinetics and Mechanism of K2O–CaO–SrO–BaO–B2O3–SiO2 Glass‐Ceramic , 2004 .
[26] K. Uematsu,et al. Grain‐Oriented Microstructure of Alumina Ceramics Made through the Injection Molding Process , 2005 .
[27] J. Jean,et al. Sintering of a crystallizable CaO-B2O3-SiO2 glass with silver , 2004 .
[28] Rao Tummala,et al. Ceramic and Glass‐Ceramic Packaging in the 1990s , 1991 .
[29] Seong‐Hyeon Hong,et al. Effect of Surface Impurities on the Microstructure Development during Sintering of Alumina , 2004 .
[30] Y. Imanaka,et al. Influence of Shrinkage Mismatch between Copper and Ceramics on Dimensional Control of the Multilayer Ceramic Circuit Board , 1992 .
[31] Hideo Takamizawa,et al. Low Firing Temperature Multilayer Glass-Ceramic Substrate , 1983 .
[32] J. Ferreira,et al. Microstructure and thermal conductivity of porous ZrO2 ceramics , 2007 .
[33] Takashi Yamaguchi,et al. Sintering and microstructure development of glass-bonded silver thick films , 1984 .
[34] J. Jean,et al. Crystallization Kinetics and Mechanism of Low‐Dielectric, Low‐Temperature, Cofirable CaO‐B2O3‐SiO2 Glass‐Ceramics , 1999 .
[35] H. Sawhill. Materials Compatibility and Co‐Sintering Aspects in Low Temperature Co‐Fired Ceramic Packages , 2008 .
[36] Gustaf Arrhenius,et al. X-ray diffraction procedures for polycrystalline and amorphous materials , 1955 .
[37] A. Atkinson,et al. Microstructure evolution in thin zirconia films: Experimental observation and modelling , 2011 .
[38] Yoshihiko Imanaka,et al. Multilayered low temperature cofired ceramics (LTCC) technology , 2004 .
[39] Sunit Rane,et al. Properties of lead-free conductive thick films of co-precipitated silver–palladium powders , 2005 .
[40] Yongxiang Li,et al. Sintering and Microwave Dielectric Properties of the LiNb0.63Ti0.4625O3 Ceramics with the B2O3–SiO2 Liquid‐Phase Additives , 2009 .
[41] Young‐Chang Joo,et al. Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films , 2003 .
[42] R. L. Coble,et al. Sintering Crystalline Solids. I. Intermediate and Final State Diffusion Models , 1961 .
[43] Min Liu,et al. Study on properties of CaO–SiO2–B2O3 system glass-ceramic , 2007 .
[44] W. Tuan,et al. Effect of Silver on the Sintering and Grain-Growth Behavior of Barium Titanate , 2000 .
[45] A. Evans,et al. Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging , 1985 .
[46] H. Yong,et al. Study of gel-tape-casting process of ceramic materials , 2002 .
[47] Shih‐Chang Lin,et al. The Effect of Anisotropic Shrinkage in Tape-Cast Low-Temperature Cofired Ceramics on Camber Development of Bilayer Laminates , 2011 .
[48] J. Bobick,et al. Hydroxylapatite synthesis and characterization in dense polycrystalline form , 1976 .
[49] Sea-Fue Wang,et al. Effect of SiO2 addition on the microstructure and microwave dielectric properties of ultra-low fire TiTe3O8 ceramics , 2009 .
[50] James F. Shackelford,et al. Introduction to materials science for engineers , 1985 .
[51] P.J.G. Schreurs,et al. Microstructure evolution of tin-lead solder , 2004, IEEE Transactions on Components and Packaging Technologies.
[52] Yuxiang Chen,et al. Diffusivity of silver ions in the low temperature co-fired ceramic (LTCC) substrates , 2011, Journal of Materials Science.
[53] Jau-Ho Jean,et al. Effects of Silver‐Paste Formulation on Camber Development during the Cofiring of a Silver‐Based, Low‐Temperature‐Cofired Ceramic Package , 2005 .
[54] R. Pullar,et al. A mechanism for low-temperature sintering , 2006 .
[55] I. Aksay,et al. Thermodynamics of densification of powder compact , 2009 .
[56] M. Hrovat,et al. Thick-film NTC thermistors and LTCC materials: The dependence of the electrical and microstructural characteristics on the firing temperature , 2007 .
[57] H. Rezaie,et al. Crystallization and sintering characteristics of CaO–Al2O3–SiO2 glasses in the presence of TiO2, CaF2 and ZrO2 , 2009 .
[58] A. Kipka,et al. Zero Shrinkage of LTCC by Self‐Constrained Sintering , 2005 .
[59] 文男 内木場,et al. Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, 著者 Yoshihiko Imanaka, 出版社 Springer Science+Business Media Inc./USA, 発行年 2005年, ISBN 0-387-23130-7, $129.00 , 2005 .
[60] S. Gangal,et al. Silver thick film pastes for low temperature co‐fired ceramics: impact of glass frit variation , 2008 .
[61] Wen-Hsi Lee,et al. Low‐Temperature Sintering and Microwave Dielectric Properties of Anorthite‐Based Glass‐Ceramics , 2002 .
[62] C. B. Carter,et al. Faceting Behavior of Alumina in the Presence of a Glass , 1990 .
[63] W. Kaysser,et al. Growth of Mo grains around Al2O3 particles during liquid phase sintering , 1985 .