A 0.1 /spl mu/m CMOS with a step channel profile formed by ultra high vacuum CVD and in-situ doped ions
暂无分享,去创建一个
In this paper, a novel O.1 /spl mu/m CMOS device with a step channel profile is proposed in order to attain low gate depletion layer capacitance and high punchthrough immunity. The step channel profile of boron for n-MOSFET, phosphorus for p-MOSFET was formed, utilizing ultra high vacuum (UHV) CVD and in-situ doped ions.<<ETX>>
[1] D. Antoniadis,et al. Reduction of channel hot-electron-generated substrate current in sub-150-nm channel length Si MOSFET's , 1988, IEEE Electron Device Letters.
[2] B. Davari,et al. Indium channel implant for improved short-channel behavior of submicrometer NMOSFETs , 1993, IEEE Electron Device Letters.