Confining effect of oxide film on tin whisker growth

[1]  Amit L. Sharma,et al.  Whiskers growth in thin passivated Au films , 2018 .

[2]  Ming Li,et al.  Growth behavior of tin whisker on SnAg microbump under compressive stress , 2018 .

[3]  A. Bower,et al.  Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments , 2017 .

[4]  J. Ding,et al.  Spontaneous Sn whisker formation on Ti2SnC , 2017, Journal of Materials Science: Materials in Electronics.

[5]  M. Bozack,et al.  Methods for fast, reliable growth of Sn whiskers , 2016 .

[6]  E. .. Mittemeijer,et al.  The crystallographic growth directions of Sn whiskers , 2015 .

[7]  C. Nam,et al.  Surface-energy induced formation of single crystalline bismuth nanowires over vanadium thin film at room temperature. , 2014, Nano letters.

[8]  C. Handwerker,et al.  Evolution of tin whiskers and subsiding grains in thermal cycling , 2014, Journal of Materials Science.

[9]  Cai-Fu Li,et al.  The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy , 2013 .

[10]  Cai-Fu Li,et al.  Microstructure and growth mechanism of tin whiskers on RESn3 compounds , 2013 .

[11]  E. Chason,et al.  Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization , 2012 .

[12]  K. Suganuma,et al.  Sn whisker growth during thermal cycling , 2011 .

[13]  P. Vianco,et al.  Interface flow mechanism for tin whisker growth , 2011 .

[14]  Jae-pyoung Ahn,et al.  The effect of electric current and surface oxidization on the growth of Sn whiskers , 2010 .

[15]  A. Xian,et al.  Observations of continuous tin whisker growth in NdSn_3 intermetallic compound , 2009 .

[16]  T. Chuang Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints , 2007 .

[17]  King-Ning Tu,et al.  Spontaneous whisker growth on lead-free solder finishes , 2005 .

[18]  N. Vo,et al.  Tin whisker test standardization , 2005, IEEE Transactions on Electronics Packaging Manufacturing.

[19]  M. G. Norton,et al.  Electron microscopy study of tin whisker growth , 2003 .

[20]  Tu,et al.  Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. , 1994, Physical review. B, Condensed matter.

[21]  F. Huang Diffusion of Sb^ , Cd^ , Sn^ , and Zn^ in Tin , 1974 .

[22]  F. Frank XC. On tin whiskers , 1953 .