The Role of Au/Sn Solder in Packaging

Packaging is commonly known as a process to protect a single integrated circuit from the environment and to connect the electrical terminals to the printed circuit board. With increasing demands for miniaturisation and higher performance, technologies for system in package (SiP) and hybrid system integration become more important. To address the interaction of package, integrated passive components and active ICs co-design methods have to be implemented into the design flow. In order to achieve the desired system functionality different semiconductor technologies have to be combined, e.g. digital, analogue, RF, MEMS, and optoelectronics. This adds new challenges as higher level design and test capability, but also for hybrid system integration. Flip chip is a key technology for higher hybrid integration as it provides smallest footprint area and also, due to the short interconnection, lower parasitic for higher frequency applications.

[1]  H. Reichl,et al.  Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders] , 1998, Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).

[2]  H. Okamoto,et al.  The Au−Sn (Gold-tin) system , 1984 .

[3]  R. Chromik,et al.  Solder metallization interdiffusion in microelectronic interconnects , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[4]  Herbert Reichl,et al.  Spectroscopic measurement of mounting-induced strain in optoelectronic devices , 2000 .

[5]  Herbert Reichl,et al.  Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[6]  David Moser,et al.  Solder-bonded micromachined capacitive pressure sensors , 1998, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.

[7]  D. F. Baldwin,et al.  Flip chip interconnect systems using wire stud bumps and lead free solder , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[8]  Development of a Fine Pitch Bumping Process , 1990 .

[9]  Solder metallization interdiffusion in microelectronic interconnects , 2000 .