Optimization of Gold Wire Bonding Process for Microwave Components by DOE Method

In this paper, the gold wire bonding process of microwave components was studied by design of experimental (DOE) method, and the multiple linear regression equation of the pulling force corresponding with bonding parameters was obtained through the analysis of variance (ANOVA). Results showed that the degree of experimental factors influence on pulling force was as follows: bonding power>bonding temperature>bonding pressure>ultrasonic time>deformation. Additionally, the initial optimized parameter combination was got: the bonding temperature was 130 °C, the bonding pressure was 25 cN, the bonding power was 0.50 W, the ultrasonic time is 60 ms, and the deformation was 60%. The pulling force of wire bonding can be controlled in the range of 10.0 to 10.5 gf by the optimized combination of bonding parameters.

[1]  Anna Witek-Krowiak,et al.  Application of response surface methodology and artificial neural network methods in modelling and optimization of biosorption process. , 2014, Bioresource technology.

[2]  Yanhong Tian,et al.  Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation , 2018, RSC advances.

[3]  Yanhong Tian,et al.  Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process , 2018, Applied Surface Science.

[4]  Tsung-Nan Tsai,et al.  A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly , 2014, J. Intell. Manuf..

[5]  F. Che,et al.  Study on failure mode and mechanism of bond pad under Cu ball bonding process using wire pull test and finite element modeling , 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

[6]  Jong-Ning Aoh,et al.  Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding , 2004 .

[7]  V. Yusà,et al.  Application of the experimental design of experiments (DoE) for the determination of organotin compounds in water samples using HS-SPME and GC-MS/MS. , 2014, Talanta.

[9]  Chunqing Wang,et al.  Optimization and modeling for one-step synthesis process of Ag–Cu nano-particles using DOE methodology , 2016, Journal of Materials Science: Materials in Electronics.

[10]  G. Khalaj,et al.  Split tensile strength of OPC-based geopolymers: Application of DOE method in evaluating the effect of production parameters and their optimum condition , 2014 .

[11]  C. Murphy,et al.  Understanding the Seed-Mediated Growth of Gold Nanorods through a Fractional Factorial Design of Experiments. , 2017, Langmuir : the ACS journal of surfaces and colloids.

[12]  Bob Chylak,et al.  Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

[13]  S. Khoury,et al.  A comparison of copper and gold wire bonding on integrated circuit devices , 1990 .

[14]  K. Al‐Jamal,et al.  Organic Solvent-Free, One-Step Engineering of Graphene-Based Magnetic-Responsive Hybrids Using Design of Experiment-Driven Mechanochemistry , 2015, ACS applied materials & interfaces.

[15]  Fuliang Wang,et al.  Modeling and Experimental Study of the Kink Formation Process in Wire Bonding , 2014, IEEE Transactions on Semiconductor Manufacturing.

[16]  Michael Pecht,et al.  Copper Wire Bonding , 2013 .

[17]  Bob Chylak,et al.  Advances in Wire Bonding Technology for Different Bonding Wire Material , 2015 .

[18]  Xiaojiang Liu,et al.  Optimization of lead-free wave soldering process for inverter air-conditioner motherboard by DOE , 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.