The yield strength of thin copper films on Kapton
暂无分享,去创建一个
[1] Daniel Josell,et al. A new method for tensile testing of thin films , 1993 .
[2] P. Ho,et al. Adhesion and deformation study of metal/polymer structures by a stretch deformation method , 1988 .
[3] D. Read,et al. Tensile Deformation-Induced Microstructures in Freestanding Copper Thin Films * , 1994 .
[4] D. Read,et al. Tensile and fracture behavior of free-standing copper films , 1996 .
[5] Oliver Kraft,et al. Mechanical Testing of Thin Films and Small Structures , 2001 .
[6] G. Reiss,et al. Young's modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing , 1998 .
[7] M. Ashby,et al. Strain gradient plasticity: Theory and experiment , 1994 .
[8] W. Brückner,et al. Tensile testing of AlCu thin films on polyimide foils , 1999 .
[9] Lucia Nicola,et al. Discrete dislocation analysis of size effects in thin films , 2003 .
[10] G. Reiss,et al. Stress-Strain Curves by Tensile Testing of Thin Metallic Films On Thin Polyimide Foils: Al, AlCu, CuNi(Mn) , 1997 .
[11] L. Freund. The Stability of a Dislocation Threading a Strained Layer on a Substrate , 1987 .
[12] O. Kraft,et al. Deformation behavior of thin copper films on deformable substrates , 2001 .
[13] P. Ho,et al. FRACTURE OF METAL-POLYMER LINE STRUCTURES. I: SEMIFLEXIBLE POLYIMIDE , 1994 .
[14] J. Tregilgas,et al. Tensile Testing of Ultra-Thin-Film Materials Deposited on Polyimide for Mems Applications , 1998 .
[15] D. Hardwick. The mechanical properties of thin films: A review , 1987 .
[16] A NEW METHOD TO STUDY CYCLIC DEFORMATION OF THIN FILMS IN TENSION AND COMPRESSION , 1999 .
[17] William D. Nix,et al. Mechanical properties of thin films , 1989 .
[18] C. Pande,et al. Yield stress of fine grained materials , 1998 .
[19] P. Renault,et al. Damage mode tensile testing of thin gold films on polyimide substrates by X-ray diffraction and atomic force microscopy , 2003 .
[20] C. Dunn,et al. Mechanical testing of thin metallic films , 1992 .
[21] Ramnath Venkatraman,et al. Separation of film thickness and grain boundary strengthening effects in Al thin films on Si , 1992 .
[22] John C. Bravman,et al. Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications , 2000 .
[23] N. Fleck,et al. Strain gradient plasticity , 1997 .
[24] Anthony G. Evans,et al. A microbend test method for measuring the plasticity length scale , 1998 .
[25] J. Embury,et al. On dislocation storage and the mechanical response of fine scale microstructures , 1994 .
[26] D. Read. Tension-Tension Fatigue of Copper Thin Films , 1996, Structural Analysis in Microelectronics and Fiber Optics.
[27] Frans Spaepen,et al. Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers , 2000 .
[28] H. Bohn,et al. On the mechanical strength of free‐standing and substrate‐bonded Al thin films , 1995 .
[29] Eduard Arzt,et al. Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation , 1998 .
[30] C. Thompson. The yield stress of polycrystalline thin films , 1993 .
[31] David T. Read,et al. Tensile properties of free-standing aluminum thin films☆ , 2001 .
[32] Franz Faupel,et al. Adhesion and deformation of metal/polyimide layered structures , 1989 .
[33] J. Bravman,et al. Anelastic contributions to the behavior of freestanding Al thin films , 1999 .
[34] Shefford P. Baker,et al. Thin films: Stresses and mechanical properties VI , 1997 .
[35] John W. Hutchinson,et al. The mechanics of size-dependent indentation , 1998 .
[36] David T. Read,et al. A new method for measuring the strength and ductility of thin films , 1993 .
[37] E. Hall,et al. The Deformation and Ageing of Mild Steel: III Discussion of Results , 1951 .
[38] G. Muralidharan,et al. On The Influence Of Titanium Alloy Composition And Layer Thickness On The Mechanical Properties Of A Polyimide Substrate , 1998 .
[39] Oliver Kraft,et al. X-ray diffraction as a tool to study the mechanical behaviour of thin films , 2000 .