Failure analysis and virtual qualification of PBGA under multiple environmental loadings
暂无分享,去创建一个
[1] T. Koschmieder,et al. Underfilled BGAs for ceramic BGA packages and board-level reliability , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[2] Werner Engelmaier,et al. Solder Attachment Reliability, Accelerated Testing, and Result Evaluation , 1991 .
[3] T. Burnette,et al. Underfilled BGAs for a variety of plastic BGA package types and the impact on board-level reliability , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[4] M. Osterman,et al. Plastic Ball-Grid-Arrays (PBGA): Are they ready for environmentally harsh Aerospace applications? , 2002 .
[5] Abhijit Dasgupta,et al. A Demonstration of Virtual Qualification for the Design of Electronic Hardware , 2001 .