Capacitive Micromachined Ultrasonic Transducer Packaging for Forward-looking Ultrasonic Endoscope using Low Temperature Co-fired Ceramic Side Via

[1]  Misaki Hiroshima,et al.  陽極接合可能なセラミック貫通配線基板を用いた静電駆動型超音波トランスデューサ;陽極接合可能なセラミック貫通配線基板を用いた静電駆動型超音波トランスデューサ;Capacitive Micromachined Ultrasonic Transducers Using Anodically Bondable Ceramic Wafer with Through-Wafer Via , 2014 .

[2]  Naseer Sabri,et al.  Capacitive Micromachined Ultrasonic Transducers: Technology and Application , 2012 .

[3]  Pai-Chi Li,et al.  A Capacitive Micromachined Ultrasonic Transducer Array for Minimally Invasive Medical Diagnosis , 2008, Journal of Microelectromechanical Systems.

[4]  Erik Poppe,et al.  Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias , 2012 .

[5]  C. A. Rich,et al.  Modeling and Characterization of CMOS-Fabricated Capacitive Micromachined Ultrasound Transducers , 2011, Journal of Microelectromechanical Systems.

[6]  A.S. Ergun,et al.  Electrical through-wafer interconnects with sub-picofarad parasitic capacitance [MEMS packaging] , 2001, 2001 Microelectromechanical Systems Conference (Cat. No. 01EX521).

[7]  Xuefeng Zhuang,et al.  Integration of Trench-Isolated Through-Wafer Interconnects with 2D Capacitive Micromachined Ultrasonic Transducer Arrays. , 2007, Sensors and actuators. A, Physical.

[8]  K. Wise,et al.  Air-isolated through-wafer interconnects for microsystem applications , 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

[9]  Shuji Tanaka,et al.  Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues , 2014, Microelectron. Reliab..

[10]  O. Oralkan,et al.  Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame , 2009, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[11]  Masayoshi Esashi,et al.  Electrical connection using submicron porous gold bumps for wafer-level packaging of mems using anodically-bondable LTCC wafer , 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

[12]  Omer Oralkan,et al.  Capacitive micromachined ultrasonic transducers for medical imaging and therapy , 2011, Journal of micromechanics and microengineering : structures, devices, and systems.

[13]  M. Fretz,et al.  Simulation of Daisy Chain Flip-Chip interconnections , 2009 .

[14]  O. Oralkan,et al.  Interconnection and Packaging for 2D Capacitive Micromachined Ultrasonic Transducer Arrays Based on Through-Wafer Trench Isolation , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.

[15]  Masayoshi Esashi,et al.  MEMS Wafer‐Level Packaging Technology Using LTCC Wafer , 2014 .

[16]  Yogesh B Gianchandani,et al.  Micromachined bulk PZT tissue contrast sensor for fine needle aspiration biopsy. , 2007, Lab on a chip.

[17]  Xuecheng Jin,et al.  An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays , 2000, 2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121).

[18]  Ching-Hsiang Cheng,et al.  Two-dimensional capacitive micromachined ultrasonic transducer (CMUT) arrays for a miniature integrated volumetric ultrasonic imaging system , 2005, SPIE Medical Imaging.

[19]  Pai-Chi Li,et al.  6F-3 Fabrication and Assembly of a Monolithic 3D CMUT Array for Imaging Applications , 2007, 2007 IEEE Ultrasonics Symposium Proceedings.