论文信息 - Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems - 字舞流文

Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems

H. Engelmann | M. Hecker | C. Wenzel | R. Hübner | R. Reiche | N. Mattern | K. Wetzig | H. Heuer | E. Zschech | V. Hoffmann