Innovation of the fore pump and roughing pump for high-gas-flow semiconductor processing

A new screw pump has been developed as a useful backing pump for high-gas-flow semiconductor processing. The characteristic features of the screws are unequal lead and unequal slant angle, which realize higher pumping speed and smaller volume of the pumping system. This pump has a very wide dynamic range of 10−3–760 Torr with a high pumping speed and low electric power consumption by gradational lead screw structure and check valve at outlet. Furthermore, this pump is free from byproduct deposition, corrosion of inner surface and oil degradation. The backdiffusion of oils can be suppressed by admitting the N2 purge gas flow larger than 10 sccm to the inlet side of the pump.