Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Understanding the ageing of materials for electronic application is a complex challenge, in particular for composite material as electrically conductive adhesive consisting of a nonconductive polymer binder and conductive filler particles. This research involves a large amount of parameters related to both operating conditions and material structure, which act together. Accelerated testing, with the aim to consume rapidly lifetime without inducing incorrect failure mechanisms, is difficult to optimize and its modelling to describe the ageing process is a challenge. To reach this aim could be interesting for the characterization of the material but above all for the general validity of the proposed methodology.

[1]  John A. Nelder,et al.  Generalized linear models for the analysis of Taguchi-type experiments , 1991 .

[2]  Jerald F. Lawless,et al.  Statistical Models and Methods for Lifetime Data: Lawless/Statistical , 2002 .

[3]  Marcantonio Catelani,et al.  Experimental Stress Characterization of a Biomedical Ultrasound Probe Soldered With Innovative Silver Isotropically Conductive Adhesive , 2012, IEEE Transactions on Instrumentation and Measurement.

[4]  G. Geoffrey Vining,et al.  Combining Taguchi and Response Surface Philosophies: A Dual Response Approach , 1990 .

[5]  Devendra Kumar,et al.  Recent advances in isotropic conductive adhesives for electronics packaging applications , 2008 .

[6]  Marcantonio Catelani,et al.  Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials , 2010, IEEE Transactions on Instrumentation and Measurement.

[7]  Wei Li,et al.  Highly Accelerated Life Test for the Reliability Assessment of the Lead-Free SMT Mainboard , 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

[8]  Dongkai Shangguan,et al.  Lead-free Solder Interconnect Reliability , 2005 .

[9]  Daoqiang Lu,et al.  Conductive adhesives with stable contact resistance and superior impact performance , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[10]  Hovav A. Dror,et al.  Robust Experimental Design for Multivariate Generalized Linear Models , 2006, Technometrics.

[11]  G. Geoffrey Vining,et al.  Reliability Data Analysis for Life Test Experiments with Subsampling , 2010 .

[12]  John A. Nelder,et al.  Robust Design via Generalized Linear Models , 2003 .

[13]  R. H. Myers,et al.  Response Surface Alternatives to the Taguchi Robust Parameter Design Approach , 1992 .

[14]  Gordon Johnston,et al.  Statistical Models and Methods for Lifetime Data , 2003, Technometrics.

[15]  W. Meeker Accelerated Testing: Statistical Models, Test Plans, and Data Analyses , 1991 .

[16]  Peter Borgesen,et al.  Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion , 2009, 2009 59th Electronic Components and Technology Conference.

[17]  J. E. Morris,et al.  Materials characterization, conduction development, and curing-effects on reliability of isotropically conductive adhesives , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[18]  Enrique Del Castillo Announcements from the Editor , 2007 .

[19]  E. Pink,et al.  Serrated flow in a ferritic stainless steel , 1981 .

[20]  H.L.J. Pang,et al.  Vibration fatigue test and analysis for flip chip solder joints , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[21]  William G. Cochran,et al.  Experimental designs, 2nd ed. , 1957 .

[22]  Eric R. Ziegel,et al.  Reliability Improvement with Design of Experiments , 2002, Technometrics.

[23]  Ewan Macarthur,et al.  Accelerated Testing: Statistical Models, Test Plans, and Data Analysis , 1990 .

[24]  R. McBride,et al.  An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly , 1993 .

[25]  Ramón V. León,et al.  Bayesian Modeling of Accelerated Life Tests with Random Effects , 2007 .

[26]  Yi Li,et al.  Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications , 2006 .

[27]  Li Li,et al.  Reliability and failure mechanism of isotropically conductive adhesives joints , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

[28]  Abhijit Dasgupta,et al.  Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data , 2002 .

[29]  V. L. Scarano,et al.  Optimization of the Soldering Process With ECAs in Electronic Equipment: Characterization Measurement and Experimental Design , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[30]  Yu Tao,et al.  Novel Isotropical Conductive Adhesives for Electronic Packaging Application , 2009, IEEE Transactions on Advanced Packaging.

[31]  H. Reichl,et al.  A solder joint fatigue life model for combined vibration and temperature environments , 2009, 2009 59th Electronic Components and Technology Conference.

[32]  Haiyu Qi,et al.  Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach , 2008, IEEE Transactions on Advanced Packaging.