Thermal Resistance Advanced Calculator (TRAC)

A novel simulation tool, named Thermal Resistance Advanced Calculator, is presented Such a tool allows the straightforward definition of a parametric detailed thermal model of family of electronic packages with Manhattan geometry, in which anew thermal properties and/or geometrical details can vary in a chosen set. It then applies a novel parametric MOR-based approach for the automatic and fast extraction of a parametric compact thermal model of this family of electronic packages. Lastly, it automatically determines the JEDEC thermal metrics from this parametric compact thermal model for any choice of parameters in a negligible amount of time. The method is validated through the analysis of a family of exposed pad Quad Flat Packages.

[1]  Alessandro Magnani,et al.  Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[2]  Lorenzo Codecasa,et al.  Partition-based approach to parametric dynamic compact thermal modeling , 2017, Microelectron. Reliab..

[3]  Alessandro Magnani,et al.  Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources , 2018, Microelectron. Reliab..

[4]  Clemens J. M. Lasance,et al.  Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review , 2008 .

[5]  Alessandro Magnani,et al.  Compact Dynamic Modeling for Fast Simulation of Nonlinear Heat Conduction in Ultra-Thin Chip Stacking Technology , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[6]  Lorenzo Codecasa,et al.  Compact electro-thermal models of interconnects , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[7]  Andrea Irace,et al.  Circuit-Based Electrothermal Simulation of Power Devices by an Ultrafast Nonlinear MOR Approach , 2016, IEEE Transactions on Power Electronics.

[8]  Alessandro Magnani,et al.  Multi-port dynamic compact thermal models of nonlinear heat conduction , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[9]  Alessandro Magnani,et al.  Parametric compact thermal models by moment matching for variable geometry , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[10]  Lorenzo Codecasa,et al.  3-D thermal models calibration by parametric dynamic compact thermal models , 2017, Microelectron. Reliab..

[11]  V. d'Alessandro,et al.  Analysis of the Influence of Layout and Technology Parameters on the Thermal Impedance of GaAs HBT/BiFET Using a Highly-Efficient Tool , 2014, 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

[12]  Valentin Bissuel,et al.  Multi-port Dynamic Compact Thermal Models of BGA Package using Model Order Reduction and Metaheuristic Optimization , 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

[13]  P. Guerriero,et al.  Dynamic electrothermal simulation of photovoltaic plants , 2015, 2015 International Conference on Clean Electrical Power (ICCEP).

[14]  Alessandro Magnani,et al.  Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization , 2018, Microelectron. Reliab..

[15]  Alessandro Magnani,et al.  Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[16]  V. d'Alessandro,et al.  Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources , 2016, 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

[17]  Alessandro Magnani,et al.  Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction , 2015, Microelectron. J..

[18]  Alessandro Magnani,et al.  Novel approach for the extraction of nonlinear compact thermal models , 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[19]  L. Codecasa,et al.  Why matrix reduction is better than objective function based optimization in compact thermal model creation , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[20]  Lorenzo Codecasa,et al.  Novel approach to compact modeling for nonlinear thermal conduction problems , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[21]  Alessandro Magnani,et al.  Delphi-like dynamical compact thermal models using model order reduction , 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[22]  Lorenzo Codecasa Nonlinear dynamic compact thermal models by structure-preserving projection , 2014, Microelectron. J..

[23]  Alessandro Magnani,et al.  Calibration of detailed thermal models by parametric dynamic compact thermal models , 2016, 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[24]  Alessandro Magnani,et al.  Novel partition-based approach to dynamic compact thermal modeling , 2016, 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[25]  Alessandro Magnani,et al.  Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[26]  Lorenzo Codecasa,et al.  Base functions and discrete constitutive relations for staggered polyhedral grids , 2009 .

[27]  P. Guerriero,et al.  Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level , 2016, 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

[28]  Alessandro Magnani,et al.  Connecting MOR-based boundary condition independent compact thermal models , 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[29]  M. Coppola,et al.  On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction , 2017 .

[30]  Alessandro Magnani,et al.  Matrix reduction tool for creating boundary condition independent dynamic compact thermal models , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).