A low-cost test method for embedded RF passive circuits using two-tone input signals

In the last decade, substantial research has been preformed for designing RF passive filters for embedding them in RF substrates to miniaturize RF front-ends. However, little work has been done to test these embedded RF passive filters at low-cost. Currently, embedded RF filters are tested by performing highfrequency (GHz) measurements using costly instruments such as Vector Network Analyzers (VNAs) on the production floor. Since the test cost of RF substrates with embedded RF filters can be substantial, there is a need for low-cost methods for testing such embedded filters. In this paper, a low-cost method is proposed that enables the testing of embedded RF filters by using two-tone input signals and regression analysis. This method eliminates the use of VNAs for production-level testing of RF filters and also enables testing of high-frequency (GHz) passive filters at MHz frequencies. In this test method, insertion loss of a RF filter at high frequencies (in GHz range) is predicted from low-frequency response (in MHz range) of the proposed test setup using regression analysis. Thus, the test-setup cost reduces significantly. The proposed test method is demonstrated with both simulations and measurements.

[1]  Madhavan Swaminathan,et al.  A low cost method for testing integrated RF substrates , 2008, 2008 IEEE MTT-S International Microwave Symposium Digest.

[2]  Abhijit Chatterjee,et al.  Fault Detection and Automated Fault Diagnosis for Embedded Integrated Electrical Passives , 1999, J. VLSI Signal Process..

[3]  Abhijit Chatterjee,et al.  Fault detection and automated fault diagnosis for embedded integrated electrical passives , 1998, Proceedings International Conference on Computer Design. VLSI in Computers and Processors (Cat. No.98CB36273).

[4]  Abhijit Chatterjee,et al.  Prediction of analog performance parameters using fast transienttesting , 2002, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[5]  R.R. Tummala,et al.  The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade , 2004, IEEE Transactions on Advanced Packaging.

[6]  J. Freidman,et al.  Multivariate adaptive regression splines , 1991 .

[7]  C. Ward,et al.  A Novel Method for Testing Integrated RF Substrates , 2007, 2007 Asia-Pacific Microwave Conference.

[8]  M. Tentzeris,et al.  System-on-Package (SOP) Architectures for compact and low cost RF Front-end modules , 2003, 2003 33rd European Microwave Conference, 2003.

[9]  J. Nazuno Haykin, Simon. Neural networks: A comprehensive foundation, Prentice Hall, Inc. Segunda Edición, 1999 , 2000 .

[10]  Kyutae Lim,et al.  A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).