CCGA packages for space applications

Abstract Commercial-off-the-shelf (COTS) area array packaging technologies in high reliability versions are now being considered for applications, including use in a number of NASA electronic systems being utilized for both the Space Shuttle and Mars Rover missions. Indeed, recently a ceramic package version specifically tailored for high reliability applications was used to provide the processing power required for the Spirit and Opportunity Mars Rovers built by NASA-JPL. Both Rovers successfully completed their 3-months mission requirements and continued exploring the Martian surface for many more moths, providing amazing new information on previous environmental conditions of Mars and strong evidence that water exists on Mars. Understanding process, reliability, and quality assurance (QA) indicators for reliability are important for low risk insertion of these newly available packages in high reliability applications. In a previous investigation, thermal cycle test results for a non-functional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version, both having 560 I/Os, were gathered and are presented here. Test results included environmental data for three different thermal cycle regimes (−55/125 °C, −55/100 °C, and −50/75 °C). Detailed information on these—especially failure type for assemblies with high and low solder volumes—are presented. The thermal cycle test procedure followed those recommended by IPC-9701 for tin–lead solder joint assemblies. Its revision A covers guideline thermal cycle requirements for Pb-free solder joints. Key points on this specification are also discussed. In a recent investigation a fully populated CCGA with 717 I/Os was considered for assembly reliability evaluation. The functional package is a field-programmable gate array that has much higher processing power than its previous version. This new package is smaller in dimension, has no interposer, and has a thinner column wrapped with copper for reliability improvement. This paper will also present thermal cycle test results for assemblies of this and its plastic package version with 728 I/Os, both of which were exposed to four different cycle regimes. Two of these cycle profiles are specified by IPC-9701A for tin–lead, namely, −55 to 100 °C and −55 to 125 °C. One is a cycle profile specified by Mil-Std-883, namely, −65/150 °C, generally used for ceramic hybrid packages screening and qualification. The last cycle is in the range of −120 to 85 °C, a representative of electronic systems directly exposed to the Martian environment without use in a thermal control enclosure. Per IPC-9701A, test vehicles were built using daisy chain packages and were continuously monitored and/or manually checked for opens at intervals. The effects of many process and assembly variables—including corner staking commonly used for improving resistance to mechanical loading such as drop and vibration loads—were also considered as part of the test matrix. Optical photomicrographs were taken at various thermal cycle intervals to document damage progress and behavior. Representative samples of these are presented along with cross-sectional photomicrographs at higher magnification taken by scanning electron microscopy (SEM) to determine crack propagation and failure analyses for packages.