Stacked semiconductor apparatus with configurable vertical i/o and methos there-of

A stacked semiconductor device with a vertical input and output line and a configuration method thereof are provided to improve the yield by repairing the fail of the vertical input and output lines due to connection defect of TSV(Through Silicon Vias) between the stacked devices. A plurality of stacked devices include a master device and at least one slave devices(20,30,40,50). Each of a plurality of segments is connected to one of the stacked devices. N vertical connection paths(22,24,32,34) include a subset of segments. The N is an integral number above 2. The vertical connection paths pass through the plurality of stacked devices. M vertical signal paths is composed from N vertical connection paths. The M is smaller than N. At least one of vertical signal paths is comprised by the master device using at least one segment from two paths of the N vertical connection paths.