Experimental study on the thermal performance of a novel ultra-thin aluminum flat heat pipe

[1]  Yong Li,et al.  Review of applications and developments of ultra-thin micro heat pipes for electronic cooling , 2018, Applied Energy.

[2]  Ahmet Ozsoy,et al.  Thermal performance of a thermosyphon heat pipe evacuated tube solar collector using silver-water nanofluid for commercial applications , 2018, Renewable Energy.

[3]  Yong Tang,et al.  Experimental investigation of the thermal performance of heat pipe with multi-heat source and double-end cooling , 2018 .

[4]  W. Yuan,et al.  Experimental investigation on thermal performance of aluminum vapor chamber using micro-grooved wick with reentrant cavity array , 2018 .

[5]  Heng Zhang,et al.  Experimental investigation of a novel LCPV/T system with micro-channel heat pipe array , 2018 .

[6]  Seok-Hwan Moon,et al.  A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp , 2017 .

[7]  Kai-Shing Yang,et al.  A novel oxidized composite braided wires wick structure applicable for ultra-thin flattened heat pipes , 2017 .

[8]  Yong Tang,et al.  Thermal management of high-power LEDs based on integrated heat sink with vapor chamber , 2017 .

[9]  Yong Tang,et al.  Experimental investigation of the thermal performance of heat pipes with double-ended heating and middle-cooling , 2017 .

[10]  Jian Qu,et al.  Recent advances in MEMS-based micro heat pipes , 2017 .

[11]  Li Jie,et al.  Experimental investigation of capillary force in a novel sintered copper mesh wick for ultra-thin heat pipes , 2017 .

[12]  Yuji Saito,et al.  Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices , 2017 .

[13]  Mustafa Ali Ersöz,et al.  Effects of different working fluid use on the energy and exergy performance for evacuated tube solar collector with thermosyphon heat pipe , 2016 .

[14]  Siavash Ebrahimi,et al.  Analysis of critical thermal issues in 3D integrated circuits , 2016 .

[15]  Y. Li,et al.  Effects of vacuuming process parameters on the thermal performance of composite heat pipes , 2016 .

[16]  Tian-Ling Ren,et al.  A review of small heat pipes for electronics , 2016 .

[17]  J. Ling-Chin,et al.  Heat utilisation technologies: A critical review of heat pipes , 2015 .

[18]  Bo Li,et al.  Investigation of ultra-thin flattened heat pipes with sintered wick structure , 2015 .

[19]  Hao Peng,et al.  Study on heat transfer performance of an aluminum flat plate heat pipe with fins in vapor chamber , 2013 .

[20]  Wei Wang,et al.  Experimental investigation of performance for the novel flat plate solar collector with micro-channel heat pipe array (MHPA-FPC) , 2013 .

[21]  Jackson Braz Marcinichen,et al.  A review of on-chip micro-evaporation: Experimental evaluation of liquid pumping and vapor compression driven cooling systems and control , 2012 .

[22]  Masami Ikeda,et al.  ULTRA THIN HEAT PIPE AND ITS APPLICATION , 2012 .

[23]  Leonardo Kessler Slongo,et al.  Thermal Behavior Analysis of Wire Mini Heat Pipe , 2011 .

[24]  Wei Zhang,et al.  Effect of evaporation section and condensation section length on thermal performance of flat plate heat pipe , 2011 .

[25]  Wei Zhou,et al.  An Innovative Fabrication Process of Porous Metal Fiber Sintered Felts with Three-Dimensional Reticulated Structure , 2010 .

[26]  Masami Ikeda,et al.  Development of ultra thin plate-type heat pipe with less than 1 mm thickness , 2010, 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[27]  Sungho Jeong,et al.  Fabrication and evaluation of a copper flat micro heat pipe working under adverse-gravity orientation , 2008 .

[28]  G. P. Peterson,et al.  A review and comparative study of the investigations on micro heat pipes , 2007 .

[29]  Yong Tang,et al.  On Manufacturing of Long Stainless Steel Fiber with Fin by Multi-Tooth Tool and Mechanical Properties of the Fiber , 2006 .

[30]  Roshan Jeet Jee Jachuck,et al.  Integrated thermal management techniques for high power electronic devices , 2004 .