A novel data pattern dependent electromagnetic emission modeling for high speed multi-channel interconnects
暂无分享,去创建一个
Li Jun Jiang | Nick K. H. Huang | L. J. Jiang | Xingyun Luo | Yu Huichun | Huasheng Ren | N. Huang | Yu Huichun | Xingyun Luo | Huasheng Ren
[1] Gang Li,et al. Fundamental components of the IC packaging electromagnetic interference (EMI) analysis , 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
[2] W. Chew,et al. Wave-Field Interaction With Complex Structures Using Equivalence Principle Algorithm , 2007, IEEE Transactions on Antennas and Propagation.
[3] Weng Cho Chew,et al. Complex Structures Modeling Using Equivalence Principle Algorithm , 2006, 2006 IEEE Electrical Performane of Electronic Packaging.
[4] Jun Fan,et al. Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters , 2010, IEEE Transactions on Electromagnetic Compatibility.
[5] Kun-mu Chen. A mathematical formulation of the equivalence principle , 1989 .
[6] Jun Fan,et al. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz , 2009, IEEE Transactions on Microwave Theory and Techniques.
[7] Jian Feng Zhang,et al. Modified C-PMCHW formulations for scattering from PEC bodies coated by dielectric layers , 2006, 2006 IEEE Antennas and Propagation Society International Symposium.
[8] Li Jun Jiang,et al. Fast data pattern based electromagnetic interference evaluation for IC packaging , 2015, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).
[9] N. K. H. Huang,et al. Electromagnetic emissions from the IC packaging , 2012, 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
[10] Jun Fan,et al. Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors , 2010, IEEE Transactions on Electromagnetic Compatibility.