Effect of die bonding condition for die attach film performance in 3D QFN stacked die

Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects of variables bonding parameter on the mechanical adhesion and delamination of the die attach film in QFN stacked die. Samples are deliberately built with nine combination sets of die attach parameters including bonding temperature, force and time to achieve a minimum reliability performance under IPC/JEDEC Moisture Sensitivity Level 3 at reflow 260°C. Characterisation of die attach film was carried out using differential scanning calorimetry whereas it performance was carried out using shear testing machine and scanning acoustic test (SAT) is used to detect the interfacial delamination between DAF and die. The best die attach process is characterized by stable values of die attach film thermal resistance properties and optimum touch area between die/die attach film and die attach film/die.

[1]  S. Abdullah,et al.  Dicing Die Attach Film for 3D Stacked Die QFN Packages , 2007, 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.

[2]  S.N. Song,et al.  Die attach film application in multi die stack package , 2005, 2005 7th Electronic Packaging Technology Conference.

[3]  Shinji Takeda,et al.  Novel die attach films having high reliability performance for lead-free solder and CSP , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[4]  C. Harper.  Electronic Packaging and Interconnection Handbook , 2000 .

[5]  Shinji Takeda,et al.  A novel die bonding adhesive-silver filled film , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[6]  S. L. Fu,et al.  A study on the characteristic of UV curved die-attach films in stack CSP (Chip Scale Package) , 2003, Proceedings of the 12th IEEE International Conference on Fuzzy Systems (Cat. No.03CH37442).

[7]  L. L. Mercado,et al.  Multichip package delamination and die fracture analysis , 2003 .

[8]  A. N. Sinaev.  International Conference on Microelectronics , 1970 .

[9]  R. Boudreau.  Foreword contributions from the 50th electronic components and technology conference , 2001 .

[10]  J. Tanskanen,et al.  Reliability study of 3-D stacked structures , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[11]  I. Ahmad,et al.  Evaluation of Different Die Attach Film and Epoxy Pastes for Stacked Die QFN Package , 2007, 2007 9th Electronics Packaging Technology Conference.

[12]  A. Jalar,et al.  Alternative double pass dicing method for thin wafer laminated with die attach film , 2004, 2004 IEEE International Conference on Semiconductor Electronics.