High Temperature Oxygen Out-Diffusion from the Interfacial SiOx Bond Layer in Direct Silicon Bonded (DSB) Substrates
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J. Sullivan | H.R. Kirk | P.J. Ong | F.J. Henley | Sien Kang
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J. Sullivan | H.R. Kirk | P.J. Ong | F.J. Henley | Sien Kang