Microsystems: A Challenge for CAD Development

Micro systems have become possible as a result of the fast evolution of VLSI technology. Modern (BI)CMOS technology allows complete systems to be integrated on a single chip while new packaging technologies allow the use of micropattern techniques also on multichip carriers. The same micropattern techniques can also be used for designing micromechanical structures as well as silicon sensors possibly with inclusion of signal conditioning, conversion and interpretation circuitry.