Cascoded LVTSCR with tunable holding voltage for ESD protection in bulk CMOS technology without latchup danger

The lateral SCR devices used in CMOS on-chip ESD protection circuits are reviewed. Such SCR devices had been found to be accidentally triggered by noise pulses when the ICs are operated in the application systems. A cascoded design is therefore proposed to safely apply the LVTSCR devices for whole-chip ESD protection in CMOS ICs without causing unexpected operation errors or latchup danger. The temperature dependence on the holding voltage of the cascoded LVTSCRs has been investigated in detail. From the experimental verification, the cascoded LVTSCRs can be fully turned on within a time below 20 ns. The ESD robustness per layout area of the threecascoded LVTSCRs can be 0.83 V/mm 2 in a 0.35-mm silicide CMOS process without using the extra silicide-blocking and ESD-implant masks, whereas the ESD robustness of the gate-grounded NMOS is only 0.25 V/mm 2 . Such cascoded LVTSCRs with a tunable holding voltage greater than VDD can provide CMOS ICs with eAective component-level ESD protection but without causing catchup danger if it is accidentally triggered by the systemlevel overshooting or undershooting noise pulses. # 2000 Elsevier Science Ltd. All rights reserved.

[1]  R. N. Rountree,et al.  Internal chip ESD phenomena beyond the protection circuit , 1988 .

[2]  J.Y. Chen,et al.  Latchup performance of retrograde and conventional n-well CMOS technologies , 1987, IEEE Transactions on Electron Devices.

[3]  Chung-Yu Wu,et al.  Complementary-SCR ESD protection circuit with interdigitated finger-type layout for input pads of submicron CMOS IC's , 1995 .

[4]  Ming-Dou Ker Lateral SCR devices with low-voltage high-current triggering characteristics for output ESD protection in submicron CMOS technology , 1998 .

[5]  A. J. Walker,et al.  A hot-carrier triggered SCR for smart power bus ESD protection , 1995, Proceedings of International Electron Devices Meeting.

[6]  Solid-State Electronics , 1955, Nature.

[7]  Chung-Yu Wu,et al.  Complementary-LVTSCR ESD protection circuit for submicron CMOS VLSI/ULSI , 1996 .

[8]  T. Polgreen,et al.  A low-voltage triggering SCR for on-chip ESD protection at output and input pads , 1990, IEEE Electron Device Letters.

[9]  R.A. Martin,et al.  A new process for one micron and finer CMOS , 1985, 1985 International Electron Devices Meeting.

[10]  Chung-Yu Wu,et al.  A gate-coupled PTLSCR/NTLSCR ESD protection circuit for deep-submicron low-voltage CMOS ICs , 1997 .

[11]  J. W. Meredith,et al.  Microelectronics reliability , 1988, IEEE Region 5 Conference, 1988: 'Spanning the Peaks of Electrotechnology'.

[12]  Wolfgang Nikutta,et al.  Influence of the series resistance of on-chip power supply buses on internal device failure after ESD stress (MOS devices) , 1993 .

[13]  R. N. Rountree ESD protection for submicron CMOS circuits-issues and solutions , 1988, Technical Digest., International Electron Devices Meeting.

[14]  Guido Notermans,et al.  Using an SCR as ESD protection without latch-up danger , 1997 .

[15]  Chung-Yu Wu,et al.  CMOS on-chip electrostatic discharge protection circuit using four-SCR structures with low ESD-trigger voltage , 1994 .

[16]  Ming-Dou Ker ESD protection for CMOS output buffer by using modified LVTSCR devices with high trigger current , 1997 .

[17]  Chung-Yu Wu,et al.  A new on-chip ESD protection circuit with dual parasitic SCR structures for CMOS VLSI , 1992 .