Spectral analysis and experimental study of lateral capillary dynamics for flip-chip applications
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Gérard Degrez | Jean-Baptiste Valsamis | Pierre Lambert | Massimo Mastrangeli | G. Degrez | M. Mastrangeli | P. Lambert | J. Valsamis
[1] Jiandong Fang,et al. Self-Assembly Techniques for Massively Parallel Packaging of MEMS Devices , 2006 .
[2] Kenneth A. Brakke,et al. The Surface Evolver , 1992, Exp. Math..
[3] J. Andrew Yeh,et al. Self-alignment of microchips using surface tension and solid edge , 2007 .
[4] K.F. Bohringer,et al. A fully dry self-assembly process with proper in-plane orientation , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
[5] Jun Fukai,et al. Oscillation of a tilted circular pad on a droplet for the self-alignment process , 2007 .
[6] Quan Zhou,et al. Experimental study on droplet based hybrid microhandling using high speed camera , 2008, 2008 IEEE/RSJ International Conference on Intelligent Robots and Systems.
[7] C. Servais,et al. Squeeze flow theory and applications to rheometry: A review , 2005 .
[8] C. Bailey,et al. Dynamic analysis of flip-chip self-alignment , 2005, IEEE Transactions on Advanced Packaging.
[9] F. Tseng,et al. Numerical studies on micropart self-alignment using surface tension forces , 2009 .
[10] Yung-Cheng Lee,et al. Design of solder joints for self-aligned optoelectronic assemblies , 1995 .
[11] Pierre Lambert,et al. Capillary Forces in Microassembly , 2007 .
[12] J. M. Kim,et al. Dynamic modeling for resin self-alignment mechanism , 2004, Microelectron. Reliab..
[13] Part tilting in capillary-based self-assembly: Modeling and correction methods , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
[14] R. Syms,et al. Stability of surface tension self-assembled 3D MOEMS , 2006 .
[15] Hyong Tae Kim,et al. 2-Step algorithm for automatic alignment in wafer dicing process , 2004, Microelectron. Reliab..
[16] Jean-Pierre Celis,et al. Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly , 2009 .
[17] Wei Zheng,et al. Sequential shape-and-solder-directed self-assembly of functional microsystems. , 2004, Proceedings of the National Academy of Sciences of the United States of America.
[18] Michael Curt Elwenspoek,et al. Fabrication and interfacing of nanochannel devices for single-molecule studies , 2009 .
[19] Daniel F. Baldwin,et al. Compression flow modeling of underfill encapsulants for low cost flip chip assembly , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
[20] Babak A. Parviz,et al. Molten-Alloy Driven Self-Assembly for Nano and Micro Scale System Integration , 2006 .
[21] Isao Shimoyama,et al. Three-dimensional sequential self-assembly of microscale objects. , 2007, Small.
[22] N.J.A. Van Veen. Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components , 1999 .
[23] R. W. Bernstein,et al. Microoptical characterization and modeling of positioning forces on drosophila embryos self-assembled in two-dimensional arrays , 2005, Journal of Microelectromechanical Systems.
[24] M. Querry,et al. Squeeze Effects in a Flat Liquid Bridge Between Parallel Solid Surfaces , 2006 .
[25] Xiaorong Xiong,et al. Towards optimal designs for self-alignment in surface tension driven micro-assembly , 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.
[26] E. Zussman,et al. Fluidic Assembly of Optical Components , 2006, IEEE Transactions on Advanced Packaging.
[27] C Van Hoof,et al. Self-assembly from milli- to nanoscales: methods and applications , 2009, Journal of micromechanics and microengineering : structures, devices, and systems.