Analysis of Weldment by Using Finite Element Method(4) -Example Program for Residual Stress and Distortion Analysis

*HEADING3-dimensional Stress Distribution in GTAW** 프로그램 설명*NODE, NSET=NALL, INPUT=node.inp** node.inp 파일에서 절점좌표 읽어옴** 모든 요소를 NALL로 정의함*ELEMENT, TYPE=C3D8, INPUT=ele.inp, ELSET=ELALL** ele.inp 파일에서 요소 절점번호 읽어옴.** C3D8은 6면체 8절점 응력해석 요소임 *NSET,NSET=CENTER, GENERATE9, 1125 9** 9번 절점에서 1125번 절점까지 9간격(9, 18, 27......,1116, 1125)** 중앙면(x=0)면의 절점을 설정, 양쪽 대칭으로 x-방향 ** 변위가 0으로 구속하기 위한 경계조건을 설정하기 위함*NSET,NSET=BC1, 217** y 및 z 방향 구속을 위해 두 개의 절점 (x=100, y=0, z=0) 및 ** (x=100, y=0, z=200)을 설정함, 강체운동의 구속을 위함

[1]  Jae-Woong Kim,et al.  Analysis of Weldment by Using Finite Element Method(2) - Example Program for Heat Flow Analysis - , 2011 .

[2]  K. Suganuma,et al.  Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions , 2008 .

[3]  Masahiro Inoue,et al.  Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy , 2008 .

[4]  Ji-won Lee,et al.  Reliability of Sn-8 mass% Zn-3 mass% Bi lead-free solder and Zn behavior , 2005 .

[5]  T. Lui,et al.  Compositional effects on the microstructure and vibration fracture properties of Sn–Zn–Bi alloys , 2005 .

[6]  Li-Hui Chen,et al.  Resonant vibration behavior of Sn-Zn-Ag solder alloys , 2004 .

[7]  Kwang-Lung Lin,et al.  Double peritectic behavior of Ag–Zn intermetallics in Sn-Zn-Ag solder alloys , 2004 .

[8]  Kwang-Lung Lin,et al.  Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys , 2004 .

[9]  Kwang-Lung Lin,et al.  Microstructure and thermal behavior of Sn-Zn-Ag solders , 2003 .

[10]  Kwang-Lung Lin,et al.  Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys , 2003 .

[11]  Tetsuya Kobayashi,et al.  A Study on the Solderbility and Joint Reliability of Lead-Free Sn-Zn-Al Solder , 2003 .

[12]  Li-Hui Chen,et al.  Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys , 2003 .

[13]  Katsuaki Suganuma,et al.  Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys , 2003 .

[14]  K. Suganuma,et al.  Microstructure Changes in Sn-Zn/Cu Joints During Heat-Exposure , 2002 .

[15]  Kwang-Lung Lin,et al.  Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact , 2001 .

[16]  J. Tedenac,et al.  Studies of the phase equilibria in the Ag–Sn–Zn system , 2001 .

[17]  Min-Hsiung Hon,et al.  Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface , 2001 .

[18]  H. Chen,et al.  Significantly improved mechanical properties in Pb‐free, Sn‐Zn‐In solder alloy by Ag doping , 1994 .