Review of molecular dynamics/experimental study of diamond-silicon behavior in nanoscale machining

Surface integrity of parts can seriously be damaged by mechanical and thermal loads during machining leading to crack initiation, constraining of parts or damage. At present, it is very difficult to observe the diverse nanoscale physical phenomena occurring through experiments due to in-process measurement problems, inaccessible contact area of tool and workpiece, and the difficulty of surface analysis at this range. Therefore, more insight is needed, which on the long run will help to achieve high precision manufacturing with predictability, repeatability, and productivity. The most logical method presently is to explore available simulation techniques. Of the many methods of simulation, atomistic simulation methods have proven to be suitable techniques for modeling at the nanoscale. Molecular dynamics (MD) is a comprehensive physical model that contains inherent information such as geometry, velocities, and forces which can be used to derive others like energy, temperature, and stresses, thereby providing support to a wider range of engineering problems such as simulations of ductile and brittle materials. This paper is aimed at reviewing journals on the use of classical MD method (corroborating it with experimental findings) for nanoscale machining of silicon with references to its use in nanomachining of other metals when necessary.