Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System Reduction of Overfill Bump Formation During Superfilling
暂无分享,去创建一个
[1] Soo‐Kil Kim,et al. Superfilling Evolution in Cu Electrodeposition Dependence on the Aging Time of the Accelerator , 2004 .
[2] L. Thompson,et al. Adsorption and electrokinetic properties of polyethylenimine on silica surfaces , 2002 .
[3] T. Moffat,et al. Curvature Enhanced Adsorbate Coverage Model for Electrodeposition , 2006 .
[4] A. West,et al. Three-Additive Model of Superfilling of Copper , 2001 .
[5] R. Alkire,et al. In Situ Studies of Cu Deposition in the Presence of Quaternary Ammonium Salts , 1998 .
[6] Mechanically Induced Superfilling of Low-Aspect-Ratio Cavities in an Electrochemical Mechanical Deposition Process , 2004 .
[7] A. Arvia,et al. A model for molecular adsorption on the surface of a columnar structure including steric effects and adsorbate–adsorbate repulsive interactions , 2001 .
[8] P. Somasundaran,et al. Adsorption of surfactants and polymers at the solid-liquid interface , 1997 .
[9] Panayotis C. Andricacos,et al. Damascene copper electroplating for chip interconnections , 1998, IBM J. Res. Dev..
[10] V. Kislenko,et al. Complex formation of polyethyleneimine with copper(II), nickel(II), and cobalt(II) ions , 2002 .
[11] Wei-Ping Dow,et al. Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating , 2005 .
[12] T. Osaka,et al. Effects of Additives on Copper Electrodeposition in Submicrometer Trenches , 2005 .
[13] R. Thomas,et al. Adsorption of polyelectrolyte/surfactant mixtures at the air-solution interface: poly(ethyleneimine)/sodium dodecyl sulfate. , 2005, Langmuir : the ACS journal of surfaces and colloids.
[14] H. Meyer,et al. The influence of organic additives on the thickness distribution of tubular metallized through-holes , 1994 .
[15] T. Moffat,et al. Accelerator aging effects during copper electrodeposition , 2003 .
[16] A. Bard,et al. The Decomposition of the Sulfonate Additive Sulfopropyl Sulfonate in Acid Copper Electroplating Chemistries , 2003 .
[17] M. Yokoi,et al. Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath IV. Acceleration Mechanism in the Presence of Cl - Ions , 1983 .
[18] L. Curtiss,et al. Chloride Ion Catalysis of the Copper Deposition Reaction , 1995 .
[19] Daniel Wheeler,et al. Superconformal film growth: Mechanism and quantification , 2005, IBM J. Res. Dev..
[20] R. Thomas,et al. Polyelectrolyte modified solid surfaces: the consequences for ionic and mixed ionic/nonionic surfactant adsorption. , 2005, Langmuir : the ACS journal of surfaces and colloids.
[21] Soo‐Kil Kim,et al. Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization , 2003 .
[22] Alan C. West,et al. Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition , 2001 .
[23] Soo‐Kil Kim,et al. Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition , 2006 .
[24] A. D. Keizer,et al. Kinetics of polyelectrolyte adsorption. , 1997 .