A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing

Chemical mechanical polishing (CMP) is a manufacturing process in which a wafer surface is polished by pressing it against a rotating pad that is flooded with slurry. The slurry itself is a fluid containing abrasive particles. Past experimentation has shown that the distribution of suspended particles in the slurry is significantly related to the distribution of material removal on the wafer during CMP. Therefore, this study involves the development and simulation of a model that predicts the kinematics and trajectory of the abrasive particles. The simulation results compare well to data from shear cell experiments data conducted by other researchers.

[1]  S. Danyluk,et al.  Tilt and interfacial fluid pressure measurements of a disk sliding on a polymeric pad , 2005 .

[2]  Roberto Zenit,et al.  Particle–wall collisions in a viscous fluid , 2001, Journal of Fluid Mechanics.

[3]  Hans J. Herrmann,et al.  Particles in fluids , 2007, Comput. Phys. Commun..

[4]  T. G. M. Ven,et al.  The flow of suspensions , 1985 .

[5]  D Schuocker,et al.  Material Removal Mechanism Of Laser Cutting , 1984, Other Conferences.

[6]  S. G. Mason,et al.  The flow of suspensions through tubes: V. Inertial effects , 1966 .

[7]  Steven Danyluk,et al.  Contact Mechanics and Lubrication Hydrodynamics of Chemical Mechanical Polishing , 1999 .

[8]  H L Goldsmith,et al.  Flow of suspensions through tubes. X. Liquid drops as models of erythrocytes. , 1972, Biorheology.

[9]  S. R. Runnels,et al.  Tribology Analysis of Chemical‐Mechanical Polishing , 1994 .

[10]  A. Jindal,et al.  Chemical Mechanical Polishing Using Mixed Abrasive Slurries , 2002 .

[11]  J. Lin,et al.  Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves , 2006 .

[12]  Robert C. Armstrong,et al.  Laser Doppler velocimetry measurements of particle velocity fluctuations in a concentrated suspension , 2002 .

[13]  G. Subramanian.  Suspension rheology , 2022 .

[14]  Sadasivan Shankar,et al.  Three-dimensional wafer-scale copper chemical–mechanical planarization model , 2002 .

[15]  Sang-Shin Park,et al.  Three-dimensional wafer scale hydrodynamic modeling for chemical mechanical polishing , 2001 .

[16]  Vinogradova,et al.  Elastohydrodynamic Collision of Two Spheres Allowing Slip on Their Surfaces. , 2000, Journal of colloid and interface science.

[17]  Goodarz Ahmadi,et al.  Modeling the Effect of Bumpy Abrasive Particles on Chemical Mechanical Polishing , 2002 .

[18]  S. Babu,et al.  Effect of pH and Ionic Strength on Chemical Mechanical Polishing of Tantalum , 1999 .

[19]  Yongwu Zhao,et al.  A micro-contact and wear model for chemical-mechanical polishing of silicon wafers , 2002 .

[20]  David Dornfeld,et al.  Material removal mechanism in chemical mechanical polishing: theory and modeling , 2001 .

[21]  Steven Danyluk,et al.  Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing , 2000 .

[22]  J. Talbot,et al.  Effects of CMP Slurry Chemistry on the Zeta Potential of Alumina Abrasives , 2006 .

[23]  Philippe Gondret,et al.  Bouncing motion of spherical particles in fluids , 2002 .

[24]  John A. Tichy,et al.  Material removal model for chemical–mechanical polishing considering wafer flexibility and edge effects , 2004 .

[26]  Chunhong Zhou,et al.  Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO2 Chemical Mechanical Polishing , 2002 .

[27]  D. Bogy,et al.  Effects of lift on the motion of particles in the recessed regions of a slider , 1997 .

[28]  P. Saffman.  The lift on a small sphere in a slow shear flow , 1965, Journal of Fluid Mechanics.

[29]  Donald W. Schwendeman,et al.  Two‐Dimensional Wafer‐Scale Chemical Mechanical Planarization Models Based on Lubrication Theory and Mass Transport , 1999 .

[31]  Steven Danyluk,et al.  A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure Modeling and Experiments , 2005 .

[32]  Direct Visualization of Particle Dynamics in Model CMP Geometries , 2001 .