유수식 메가소닉 세정법을 이용한 농약 세척

A megasonic cleaning process, which uses ultrasonic waves near 1 ㎒ frequency, has been widely employed to remove submicron particles mainly in the semiconductor industry. A recently developed flow-type megasonic cleaner aims to remove agricultural chemicals remaining on vegetable surfaces besides tiny particles. To enhance the cleaning ability of the megasonic cleaners, we elucidate the cleaning mechanisms by visualizing the cleaning process with a high-speed camera and evaluating the efficiency through SEM measurement. It is shown that oscillating bubbles produced by megasonic waves are responsible for the removal of chemical residues on substrates. The removal force, which overweighs the particle adhesion force, is induced by pressure gradient near oscillating bubbles and by sweeping action of the bubble interface