A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly

[1]  M. F. Franklin Constructing Tables of Minimum Aberration pn-m Designs , 1984 .

[2]  James L. McClelland,et al.  Parallel distributed processing: explorations in the microstructure of cognition, vol. 1: foundations , 1986 .

[3]  Richard P. Lippmann,et al.  An introduction to computing with neural nets , 1987 .

[4]  Yoh-Han Pao,et al.  Adaptive pattern recognition and neural networks , 1989 .

[5]  László Monostori,et al.  Neural networks—Their applications and perspectives in intelligent machining , 1991 .

[6]  Li Lin,et al.  A neural network-based automated inspection system with an application to surface mount devices , 1993 .

[7]  Hans Danielsson,et al.  Surface mount technology with fine pitch components : the manufacturing issues , 1995 .

[8]  Liang-Hua Chen,et al.  A bar-code recognition system using backpropagation neural networks , 1995 .

[9]  Lefteri H. Tsoukalas,et al.  Fuzzy and neural approaches in engineering , 1997 .

[10]  Anu Maria,et al.  Engineering solder paste performance through controlled stress rheology analysis , 1998 .

[11]  H. Gieser,et al.  Very fast transmission line pulsing of integrated structures and the charged device model , 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C.

[12]  Ahmad Lotfi,et al.  Industrial Application of Fuzzy Systems: Adaptive Fuzzy Control od Solder Paste Stencil Printing , 1998, Inf. Sci..

[13]  Nduka Nnamdi (Ndy) Ekere,et al.  The behavior of solder pastes in stencil printing with vibrating squeegee , 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C.

[14]  John H. Lau,et al.  Solder joint reliability of cavity‐down plastic ball grid array assemblies , 1998 .

[15]  Jianbiao Pan,et al.  Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP , 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

[16]  Ndy Ekere,et al.  The rheological properties of solder and solar pastes and the effect on stencil printing , 2000 .

[17]  Lyndon N. Smith,et al.  A neural network approach for selection of powder metallurgy materials and process parameters , 2000, Artif. Intell. Eng..

[18]  Jeff Kennedy A study of solder paste printing requirements for CSP technology , 2000 .

[19]  Taho Yang,et al.  Modeling and implementation of a neurofuzzy system for surface mount assembly defect prediction and control , 2002 .