Multidisciplinary Reliability Design of Electronics Packaging

In the electronics packaging design, the growing complexities in conjunction with decrease in design margins are the underlying elements driving the need for a new reliability design method applicable to trade-off problems. In this work, multidisciplinary reliability analysis based on a probabilistic and multivariate statistical method has been performed for CPU module packaging in order to reveal the reliability relationship among packaging solutions and to identify the statistical trade-off mechanism among multi-objectives. It was verified that the applied method involving RSM (Response Surface Modeling) / FORM (First Order Reliability Method) / SEM (Structural Equation Modeling) can assess the packaging solutions with respect to reliability indices and failure mode correlation, and grasp the trade-off mechanism among multi-failure modes in packaging design space.

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