Comparison of Properties of Silicon-containing Poly(amide-imide)s

New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed imide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400°C and glass transition temperature in the range of 220-270°C. Very thin polymer films deposited by spin-coating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations.

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