论文信息 - CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis - 字舞流文

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

John H. L. Pang | Z. P. Wang | J. Pang | Zhaojian Wang | C. W. Seetoh | C. Seetoh

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