论文信息 - Surface Tension Powered MEMS Self-Assembly Model Reconstruction and Microstructure Thermal Distortion Analysis

Surface Tension Powered MEMS Self-Assembly Model Reconstruction and Microstructure Thermal Distortion Analysis

Along with the advancement of micro-manufacturing technique. MEMS technology develops rapidly and be applied broadly. Solder joint self-assembly is studied in this paper. Previous researchers focused on the study of analytical model and 3D static model developed in Surface Evolver. Development and reasonability validation of 3D dynamic simulation model and how to improve precision of the assembly angle through this model in Surface Evolver has been discussed in my paper (Pan Kailin et al., 2006), (Pan Kailan et al., 2007). This paper focuses on the data extraction of solder model developed in Surface Evolver, and then model reconstruction and thermal-distortion analysis are carried out in ANSYS. Firstly, obtain the configuration of solder joint and the self-assembly angle by developing the dynamic model with a certain volume of solder and pad figure in Surface Evolver by finite element method. Secondly, extract the configuration information of solder joint from Surface Evolver and then dump them to ANSYS to reconstruct the joint. Due to the character that solder joint configuration in Surface Evolver consists of many small triangles, it is hard to mesh and solution if the configuration is reconstructed directly in ANSYS. so it is need to create several splines on the configuration of the initial joint and then develop the approximate configuration of joint by skinning. Movable microstructure and lunge model are developed simultaneously in ANSYS. Thirdly, according to the soldering profile and condition, the thermal convection coefficient, the temperature and the how long the microstructure will stay during the process of soldering at each zone is obtained. Thermal-distortion analysis is performed to obtain the distortion of the movable microstructure caused during the soldering process. It can provide theory for the MEMS self-assembly model developing and self-assembly experiment. Further research should focus on the position optimization of lunge and limiter.

Yilin Yan | Peng Li | Kailin Pan | Ni Li | Yexiang Ning

[1] Victor M. Bright,et al. Solder self-assembly for three-dimensional microelectromechanical systems , 1999 .

[2] Paul E. Kladitis. Issues in the Design, Modeling, and Manufacture of Multiple Joint Solder Self-Assembled Micro-Electro-Mechanical Systems (MEMS) , 2001 .

[3] R. Syms. Equilibrium of hinged and hingeless structures rotated using surface tension forces , 1995 .

[4] Kailin Pan,et al. Precisely Controlling Assembly Angle of Surface Tension Powered Self-Assembly for MEMS Microstructures , 2007 .

[5] R. Syms. Surface tension powered self-assembly of 3-D micro-optomechanical structures , 1999 .

[6] George M. Whitesides,et al. Surface tension-powered self-assembly of microstructures - the state-of-the-art , 2003 .

[7] Richard R. A. Syms,et al. Improving yield, accuracy and complexity in surface tension self-assembled MOEMS , 2001 .

[8] Yung-Cheng Lee,et al. Modeling for solder self-assembled MEMS , 1998, Photonics West.

[9] Kailin Pan,et al. Modeling for Solder Self-Assembly of MEMS Microstructure Powered by Surface Tension , 2006, 2006 7th International Conference on Electronic Packaging Technology.

[10] Y.C. Lee,et al. Study of micro-scale limits of solder self-assembly for MEMS , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).